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Discrete Semiconductor Products

JAN2N3507L

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Microchip Technology

NPN SILICON SWITCHING 40V TO 50V, 3A

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Search across all available documentation for this part.

Discrete Semiconductor Products

JAN2N3507L

Active
Microchip Technology

NPN SILICON SWITCHING 40V TO 50V, 3A

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationJAN2N3507L
Current - Collector (Ic) (Max) [Max]3 A
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]30
GradeMilitary
Mounting TypeThrough Hole
Package / CaseTO-205AA, TO-5-3 Metal Can
Power - Max [Max]1 W
Supplier Device PackageTO-5
Transistor TypeNPN
Vce Saturation (Max) @ Ib, Ic1.5 V
Voltage - Collector Emitter Breakdown (Max) [Max]50 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 100$ 11.90
Microchip DirectN/A 1$ 12.81
NewarkEach 100$ 11.90
500$ 11.44

Description

General part information

JANTX2N3507AL-Transistor Series

This specification covers the performance requirements for NPN, silicon, switching 2N3506 and 2N3507 transistors. Four levels of product assurance (JAN, JANTX, JANTXV and JANS) are provided for each device type as specified in MIL-PRF-19500/349. Two levels of product assurance are provided for each unencapsulated die (JANHC and JANKC). Provisions for radiation hardness assurance (RHA) to eight radiation levels is provided for JANTXV, JANS, JANHC, and JANKC product assurance levels. RHA level designators "M", "D", "P", "L", "R", "F", "G", and "H" are appended to the device prefix to identify devices, which have passed RHA requirements. The device package for the encapsulated device type are as follows: Similar to TO-39 and surface mount version U4. The dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/349.

Documents

Technical documentation and resources