
IXYN100N120B3H1
ActiveDISC IGBT XPT-GENX3 SOT-227UI(MINI/ TUBE
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IXYN100N120B3H1
ActiveDISC IGBT XPT-GENX3 SOT-227UI(MINI/ TUBE
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Technical Specifications
Parameters and characteristics for this part
| Specification | IXYN100N120B3H1 |
|---|---|
| Configuration | Single |
| Current - Collector (Ic) (Max) [Max] | 165 A |
| Current - Collector Cutoff (Max) [Max] | 50 µA |
| IGBT Type | PT |
| Input | Standard |
| Input Capacitance (Cies) @ Vce | 6 nF |
| Mounting Type | Chassis Mount |
| NTC Thermistor | False |
| Operating Temperature [Max] | 150 °C |
| Operating Temperature [Min] | -55 °C |
| Package / Case | SOT-227-4, miniBLOC |
| Power - Max [Max] | 690 W |
| Supplier Device Package | SOT-227B |
| Vce(on) (Max) @ Vge, Ic [Max] | 2.6 V |
| Voltage - Collector Emitter Breakdown (Max) [Max] | 1200 V |
Planar Series
Disc IGBT BiMSFT-VeryHiVolt TO-268AA
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Vce(on) (Max) @ Vge, Ic | Current - Collector (Ic) (Max) [Max] | Voltage - Collector Emitter Breakdown (Max) [Max] | Supplier Device Package | Gate Charge | Package / Case | Switching Energy | Test Condition | Current - Collector Pulsed (Icm) | Mounting Type | Power - Max [Max] | Td (on/off) @ 25°C | IGBT Type | Current - Collector Cutoff (Max) [Max] | Vce(on) (Max) @ Vge, Ic [Max] | Configuration | Input Capacitance (Cies) @ Vce | NTC Thermistor | Input | Td (on/off) @ 25°C [Min] | Td (on/off) @ 25°C [Max] | Reverse Recovery Time (trr) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
LITTELFUSE | 175 °C | -55 °C | 2.7 V | 310 A | 900 V | TO-264 (IXYK) | 330 nC | TO-264-3 TO-264AA | 4 mJ 4.3 mJ | 1 Ohm 15 V 100 A 450 V | 840 A | Through Hole | 1630 W | 40 ns 145 ns | ||||||||||
LITTELFUSE | 150 °C | -55 °C | 165 A | 1200 V | SOT-227B | SOT-227-4 miniBLOC | Chassis Mount | 690 W | PT | 50 µA | 2.6 V | Single | 6 nF | Standard | ||||||||||
LITTELFUSE | 175 °C | -55 °C | 2.5 V | 600 V | TO-247AD | 200 nC | TO-247-2 | 1.8 mJ 3.4 mJ | 2 Ohm 15 V 75 A 400 V | 150 A | Through Hole | 1360 W | PT | 34 ns | 120 ns | |||||||||
LITTELFUSE | 175 °C | -55 °C | 3.2 V | 240 A | 1200 V | SOT-227B - miniBLOC | SOT-227-4 miniBLOC | Chassis Mount | 25 µA | Single | Standard | |||||||||||||
LITTELFUSE | 150 °C | -55 °C | 3.5 V | 5 A | 2500 V | TO-268AA | 10.6 nC | D3PAK (2 Leads + Tab) TO-268-3 TO-268AA | 13 A | Surface Mount | 32 W | 920 ns | ||||||||||||
LITTELFUSE | 175 °C | -55 °C | 20 A | 900 V | TO-252AA | 13.3 nC | DPAK (2 Leads + Tab) SC-63 TO-252-3 | 180 µJ 460 µJ | 8 A 15 V 30 Ohm 450 V | 48 A | Surface Mount | 16 ns 40 ns | 2.5 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
Planar Series
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements
Documents
Technical documentation and resources