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IXYK1x0xNxxxx
Discrete Semiconductor Products

IXYN120N120C3

Active
LITTELFUSE

DISC IGBT XPT-GENX3 SOT-227B(MINI/ TUBE

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IXYK1x0xNxxxx
Discrete Semiconductor Products

IXYN120N120C3

Active
LITTELFUSE

DISC IGBT XPT-GENX3 SOT-227B(MINI/ TUBE

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationIXYN120N120C3
ConfigurationSingle
Current - Collector (Ic) (Max) [Max]240 A
Current - Collector Cutoff (Max) [Max]25 µA
InputStandard
Mounting TypeChassis Mount
NTC ThermistorFalse
Operating Temperature [Max]175 °C
Operating Temperature [Min]-55 °C
Package / CaseSOT-227-4, miniBLOC
Supplier Device PackageSOT-227B - miniBLOC
Vce(on) (Max) @ Vge, Ic3.2 V
Voltage - Collector Emitter Breakdown (Max) [Max]1200 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$Updated
DigikeyTube 1$ 40.221m+
10$ 35.84
100$ 31.46
MouserN/A 1$ 40.891m+
10$ 30.55
100$ 27.81
NewarkEach 250$ 29.151m+

Description

General part information

Planar Series

Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements