Zenode.ai Logo
Beta
ROHM BSM600D12P3G001
Discrete Semiconductor Products

BSM600D12P3G001

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, HALF BRIDGE, DUAL N CHANNEL, 600 A, 1.2 KV, MODULE

Deep-Dive with AI

Search across all available documentation for this part.

ROHM BSM600D12P3G001
Discrete Semiconductor Products

BSM600D12P3G001

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, HALF BRIDGE, DUAL N CHANNEL, 600 A, 1.2 KV, MODULE

Technical Specifications

Parameters and characteristics for this part

SpecificationBSM600D12P3G001
Configuration2 N-Channel (Half Bridge)
Current - Continuous Drain (Id) @ 25°C600 A
Drain to Source Voltage (Vdss)1200 V
Drain to Source Voltage (Vdss)1.2 kV
Input Capacitance (Ciss) (Max) @ Vds31000 pF
Mounting TypeChassis Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-40 °C
Package / CaseModule
Power - Max [Max]2450 W
Supplier Device PackageModule
TechnologySilicon Carbide (SiC)
Vgs(th) (Max) @ Id5.6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 1785.00

Description

General part information

BSM600D12P3G001 Series

BSM600D12P3G001 is a half bridge module consisting of SiC-UMOSFET and SiC-SBD, suitable for motor drive, inverter, converter, photovoltaics, wind power generation, induction heating equipment.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Judgment Criteria of Thermal Evaluation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

What Is Thermal Design

Thermal Design

Evaluation Board User's Guide

User's Guide

How to Create Symbols for PSpice Models

Models

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

How to Use PLECS Models

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Compliance of the ELV directive

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Thermal Resistance Measurement Method for SiC MOSFET

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

About Export Regulations

Export Information

PCB Layout Thermal Design Guide

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

Optimized heat sink assembly method for effective heat dissipation

Thermal Design