Specification	10061913-103TLF

Card Thickness	1.57 mm
Card Thickness	0.062 in
Card Type	PCI Express™
Color	Black
Contact Finish	Gold
Contact Finish Thickness	30 Áin
Contact Finish Thickness	0.76 Ám
Contact Material	Copper Alloy
Contact Type	Cantilever
Features	Locking Ramp, Board Guide, Solder Retention
Gender	Female
Material - Insulation	Nylon, Glass Filled, Polyamide (PA)
Mounting Type	Surface Mount
Number of Positions	164
Number of Rows [custom]	2
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-55 C
Pitch	1 mm
Pitch	0.039 in
Read Out	Dual
Termination	Solder

10061913 Series

Part	Material - Insulation	Contact Finish Thickness	Contact Finish Thickness	Operating Temperature [Min]	Operating Temperature [Max]	Read Out	Number of Positions	Color	Contact Material	Contact Type	Number of Rows [custom]	Termination	Features	Gender	Mounting Type	Card Type	Contact Finish	Pitch	Pitch	Card Thickness	Card Thickness	Contact Finish Thickness	Termination Rows [custom]	Number of Positions/Bay/Row [custom]	Number of Positions/Bay/Row [custom]
Amphenol ICC (FCI) 10061913-103TLF	Glass Filled Nylon Polyamide (PA)	30 Áin	0.76 Ám	-55 C	85 °C	Dual	164	Black	Copper Alloy	Cantilever	2	Solder	Board Guide Locking Ramp Solder Retention	Female	Surface Mount	PCI Express™	Gold	1 mm	0.039 in	1.57 mm	0.062 in
Amphenol ICC (FCI) 10061913-110ALF	Glass Filled Nylon Polyamide (PA)	15 µin	0.38 µm	-55 C	85 °C	Dual	36	Black	Copper Alloy	Cantilever	2	Solder	Board Guide Locking Ramp Pick and Place Solder Retention	Female	Surface Mount	PCI Express™	Gold	1 mm	0.039 in	1.57 mm	0.062 in
Amphenol ICC (FCI) 10061913-120MLF	Glass Filled Nylon Polyamide (PA)			-55 C	85 °C	Dual	36	Black	Copper Alloy	Cantilever	2	Solder	Board Guide Locking Ramp Pick and Place Solder Retention	Female	Surface Mount	PCI Express™	Gold	1 mm	0.039 in	1.57 mm	0.062 in	Flash
Amphenol ICC (FCI) 10061913-112MLF	Glass Filled Nylon Polyamide (PA)	15 µin	0.38 µm	-55 C	85 °C	Dual	98	Black	Copper Alloy	Cantilever	2	Solder	Board Guide Locking Ramp Pick and Place Solder Retention	Female	Surface Mount	PCI Express™	Gold	1 mm	0.039 in	1.57 mm	0.062 in		2
Amphenol ICC (FCI) 10061913-110RLF	Glass Filled Nylon Polyamide (PA)	15 µin	0.38 µm	-55 C	85 °C	Dual	36	Black	Copper Alloy	Cantilever	2	Solder	Board Guide Locking Ramp Pick and Place Solder Retention	Female	Surface Mount	PCI Express™	Gold	1 mm	0.039 in	1.57 mm	0.062 in
Amphenol ICC (FCI) 10061913-103NLF	Glass Filled Nylon Polyamide (PA)	30 Áin	0.76 Ám	-55 C	85 °C	Dual	164	Black	Copper Alloy	Cantilever	2	Solder	Board Guide Locking Ramp Pick and Place Solder Retention	Female	Surface Mount	PCI Express™	Gold	1 mm	0.039 in	1.57 mm	0.062 in
Amphenol ICC (FCI) 10061913-131CLF	Glass Filled Nylon Polyamide (PA)			-55 C	85 °C	Dual	64	Black	Copper Alloy	Cantilever	2	Solder	Board Guide Locking Ramp Pick and Place Solder Retention	Female	Surface Mount	PCI Express™	Gold	1 mm	0.039 in	1.57 mm	0.062 in	Flash
Amphenol ICC (FCI) 10061913-100ALF	Glass Filled Nylon Polyamide (PA)	30 Áin	0.76 Ám	-55 C	85 °C	Dual	36	Black	Copper Alloy	Cantilever	2	Solder	Board Guide Locking Ramp Pick and Place Solder Retention	Female	Surface Mount	PCI Express™	Gold	1 mm	0.039 in	1.57 mm	0.062 in
Amphenol ICC (FCI) 10061913-123CLF	Glass Filled Nylon Polyamide (PA)			-55 C	85 °C	Dual	164	Black	Copper Alloy	Cantilever	2	Solder	Board Guide Locking Ramp Pick and Place Solder Retention	Female	Surface Mount	PCI Express™	Gold	1 mm	0.039 in	1.57 mm	0.062 in	Flash		11	71
Amphenol ICC (FCI) 10061913-110PLF	Glass Filled Nylon Polyamide (PA)	15 µin	0.38 µm	-55 C	85 °C	Dual	36	Black	Copper Alloy	Cantilever	2	Solder	Board Guide Locking Ramp Pick and Place Solder Retention	Female	Surface Mount	PCI Express™	Gold	1 mm	0.039 in	1.57 mm	0.062 in