10061913 Series
Manufacturer: Amphenol ICC (FCI)
CONN PCI EXP FMALE 164POS 0.039
| Part | Material - Insulation | Contact Finish Thickness | Contact Finish Thickness | Operating Temperature [Min] | Operating Temperature [Max] | Read Out | Number of Positions | Color | Contact Material | Contact Type | Number of Rows [custom] | Termination | Features | Gender | Mounting Type | Card Type | Contact Finish | Pitch | Pitch | Card Thickness | Card Thickness | Contact Finish Thickness | Termination Rows [custom] | Number of Positions/Bay/Row [custom] | Number of Positions/Bay/Row [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | 30 Áin | 0.76 Ám | -55 C | 85 °C | Dual | 164 | Black | Copper Alloy | Cantilever | 2 | Solder | Board Guide Locking Ramp Solder Retention | Female | Surface Mount | PCI Express™ | Gold | 1 mm | 0.039 in | 1.57 mm | 0.062 in | ||||
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | 15 µin | 0.38 µm | -55 C | 85 °C | Dual | 36 | Black | Copper Alloy | Cantilever | 2 | Solder | Board Guide Locking Ramp Pick and Place Solder Retention | Female | Surface Mount | PCI Express™ | Gold | 1 mm | 0.039 in | 1.57 mm | 0.062 in | ||||
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | -55 C | 85 °C | Dual | 36 | Black | Copper Alloy | Cantilever | 2 | Solder | Board Guide Locking Ramp Pick and Place Solder Retention | Female | Surface Mount | PCI Express™ | Gold | 1 mm | 0.039 in | 1.57 mm | 0.062 in | Flash | |||||
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | 15 µin | 0.38 µm | -55 C | 85 °C | Dual | 98 | Black | Copper Alloy | Cantilever | 2 | Solder | Board Guide Locking Ramp Pick and Place Solder Retention | Female | Surface Mount | PCI Express™ | Gold | 1 mm | 0.039 in | 1.57 mm | 0.062 in | 2 | |||
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | 15 µin | 0.38 µm | -55 C | 85 °C | Dual | 36 | Black | Copper Alloy | Cantilever | 2 | Solder | Board Guide Locking Ramp Pick and Place Solder Retention | Female | Surface Mount | PCI Express™ | Gold | 1 mm | 0.039 in | 1.57 mm | 0.062 in | ||||
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | 30 Áin | 0.76 Ám | -55 C | 85 °C | Dual | 164 | Black | Copper Alloy | Cantilever | 2 | Solder | Board Guide Locking Ramp Pick and Place Solder Retention | Female | Surface Mount | PCI Express™ | Gold | 1 mm | 0.039 in | 1.57 mm | 0.062 in | ||||
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | -55 C | 85 °C | Dual | 64 | Black | Copper Alloy | Cantilever | 2 | Solder | Board Guide Locking Ramp Pick and Place Solder Retention | Female | Surface Mount | PCI Express™ | Gold | 1 mm | 0.039 in | 1.57 mm | 0.062 in | Flash | |||||
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | 30 Áin | 0.76 Ám | -55 C | 85 °C | Dual | 36 | Black | Copper Alloy | Cantilever | 2 | Solder | Board Guide Locking Ramp Pick and Place Solder Retention | Female | Surface Mount | PCI Express™ | Gold | 1 mm | 0.039 in | 1.57 mm | 0.062 in | ||||
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | -55 C | 85 °C | Dual | 164 | Black | Copper Alloy | Cantilever | 2 | Solder | Board Guide Locking Ramp Pick and Place Solder Retention | Female | Surface Mount | PCI Express™ | Gold | 1 mm | 0.039 in | 1.57 mm | 0.062 in | Flash | 11 | 71 | |||
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | 15 µin | 0.38 µm | -55 C | 85 °C | Dual | 36 | Black | Copper Alloy | Cantilever | 2 | Solder | Board Guide Locking Ramp Pick and Place Solder Retention | Female | Surface Mount | PCI Express™ | Gold | 1 mm | 0.039 in | 1.57 mm | 0.062 in |