Specification	10061913-131CLF

Card Thickness	1.57 mm
Card Thickness	0.062 in
Card Type	PCI Express™
Color	Black
Contact Finish	Gold
Contact Finish Thickness	Flash
Contact Material	Copper Alloy
Contact Type	Cantilever
Features	Solder Retention, Locking Ramp, Board Guide, Pick and Place
Gender	Female
Material - Insulation	Nylon, Glass Filled, Polyamide (PA)
Mounting Type	Surface Mount
Number of Positions	64
Number of Rows [custom]	2
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-55 C
Pitch	1 mm
Pitch	0.039 in
Read Out	Dual
Termination	Solder

10061913 Series

Part	Material - Insulation	Contact Finish Thickness	Contact Finish Thickness	Operating Temperature [Min]	Operating Temperature [Max]	Read Out	Number of Positions	Color	Contact Material	Contact Type	Number of Rows [custom]	Termination	Features	Gender	Mounting Type	Card Type	Contact Finish	Pitch	Pitch	Card Thickness	Card Thickness	Contact Finish Thickness	Termination Rows [custom]	Number of Positions/Bay/Row [custom]	Number of Positions/Bay/Row [custom]
Amphenol ICC (FCI) 10061913-103TLF	Glass Filled Nylon Polyamide (PA)	30 Áin	0.76 Ám	-55 C	85 °C	Dual	164	Black	Copper Alloy	Cantilever	2	Solder	Board Guide Locking Ramp Solder Retention	Female	Surface Mount	PCI Express™	Gold	1 mm	0.039 in	1.57 mm	0.062 in
Amphenol ICC (FCI) 10061913-110ALF	Glass Filled Nylon Polyamide (PA)	15 µin	0.38 µm	-55 C	85 °C	Dual	36	Black	Copper Alloy	Cantilever	2	Solder	Board Guide Locking Ramp Pick and Place Solder Retention	Female	Surface Mount	PCI Express™	Gold	1 mm	0.039 in	1.57 mm	0.062 in
Amphenol ICC (FCI) 10061913-120MLF	Glass Filled Nylon Polyamide (PA)			-55 C	85 °C	Dual	36	Black	Copper Alloy	Cantilever	2	Solder	Board Guide Locking Ramp Pick and Place Solder Retention	Female	Surface Mount	PCI Express™	Gold	1 mm	0.039 in	1.57 mm	0.062 in	Flash
Amphenol ICC (FCI) 10061913-112MLF	Glass Filled Nylon Polyamide (PA)	15 µin	0.38 µm	-55 C	85 °C	Dual	98	Black	Copper Alloy	Cantilever	2	Solder	Board Guide Locking Ramp Pick and Place Solder Retention	Female	Surface Mount	PCI Express™	Gold	1 mm	0.039 in	1.57 mm	0.062 in		2
Amphenol ICC (FCI) 10061913-110RLF	Glass Filled Nylon Polyamide (PA)	15 µin	0.38 µm	-55 C	85 °C	Dual	36	Black	Copper Alloy	Cantilever	2	Solder	Board Guide Locking Ramp Pick and Place Solder Retention	Female	Surface Mount	PCI Express™	Gold	1 mm	0.039 in	1.57 mm	0.062 in
Amphenol ICC (FCI) 10061913-103NLF	Glass Filled Nylon Polyamide (PA)	30 Áin	0.76 Ám	-55 C	85 °C	Dual	164	Black	Copper Alloy	Cantilever	2	Solder	Board Guide Locking Ramp Pick and Place Solder Retention	Female	Surface Mount	PCI Express™	Gold	1 mm	0.039 in	1.57 mm	0.062 in
Amphenol ICC (FCI) 10061913-131CLF	Glass Filled Nylon Polyamide (PA)			-55 C	85 °C	Dual	64	Black	Copper Alloy	Cantilever	2	Solder	Board Guide Locking Ramp Pick and Place Solder Retention	Female	Surface Mount	PCI Express™	Gold	1 mm	0.039 in	1.57 mm	0.062 in	Flash
Amphenol ICC (FCI) 10061913-100ALF	Glass Filled Nylon Polyamide (PA)	30 Áin	0.76 Ám	-55 C	85 °C	Dual	36	Black	Copper Alloy	Cantilever	2	Solder	Board Guide Locking Ramp Pick and Place Solder Retention	Female	Surface Mount	PCI Express™	Gold	1 mm	0.039 in	1.57 mm	0.062 in
Amphenol ICC (FCI) 10061913-123CLF	Glass Filled Nylon Polyamide (PA)			-55 C	85 °C	Dual	164	Black	Copper Alloy	Cantilever	2	Solder	Board Guide Locking Ramp Pick and Place Solder Retention	Female	Surface Mount	PCI Express™	Gold	1 mm	0.039 in	1.57 mm	0.062 in	Flash		11	71
Amphenol ICC (FCI) 10061913-110PLF	Glass Filled Nylon Polyamide (PA)	15 µin	0.38 µm	-55 C	85 °C	Dual	36	Black	Copper Alloy	Cantilever	2	Solder	Board Guide Locking Ramp Pick and Place Solder Retention	Female	Surface Mount	PCI Express™	Gold	1 mm	0.039 in	1.57 mm	0.062 in