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40-6518-10
Connectors, Interconnects

40-6518-10

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Aries Electronics

CONN IC DIP SOCKET 40POS GOLD

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40-6518-10
Connectors, Interconnects

40-6518-10

Active
Aries Electronics

CONN IC DIP SOCKET 40POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification40-6518-10
Contact Finish - MatingGold
Contact Finish - PostTin
Contact Finish Thickness - Mating0.25 µm
Contact Finish Thickness - Mating10 µin
Contact Finish Thickness - Post200 µin
Contact Finish Thickness - Post5.08 µm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)3 A
FeaturesOpen Frame
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)40
Pitch - Mating0.1 "
Pitch - Mating2.54 mm
Pitch - Post0.1 in
Pitch - Post2.54 mm
TerminationSolder
Termination Post Length0.125 in
Termination Post Length3.18 mm
TypeDIP
Type [custom]15.24 mm
Type [custom]0.6 in
PartCurrent Rating (Amps)Termination Post LengthTermination Post LengthMaterial Flammability RatingContact Material - MatingContact Finish - MatingNumber of Positions or Pins (Grid)Mounting TypeContact Finish Thickness - MatingContact Finish Thickness - MatingType [custom]Type [custom]TypeContact Finish Thickness - PostContact Finish Thickness - PostContact Material - Post [custom]Pitch - PostPitch - PostTerminationHousing MaterialPitch - MatingPitch - MatingFeaturesContact Finish - Post
40-6518-11
Aries Electronics
3 A
0.125 in
3.18 mm
UL94 V-0
Beryllium Copper
Gold
40
Through Hole
0.25 µm
10 µin
15.24 mm
0.6 in
DIP
10 Áin
0.25 çm
Brass
0.1 in
2.54 mm
Solder
Polyamide (PA46)
Nylon 4/6
Glass Filled
0.1 "
2.54 mm
Open Frame
Gold
40-6518-10
Aries Electronics
3 A
0.125 in
3.18 mm
UL94 V-0
Beryllium Copper
Gold
40
Through Hole
0.25 µm
10 µin
15.24 mm
0.6 in
DIP
200 µin
5.08 µm
Brass
0.1 in
2.54 mm
Solder
Polyamide (PA46)
Nylon 4/6
Glass Filled
0.1 "
2.54 mm
Open Frame
Tin
40-6518-11H
Aries Electronics
3 A
0.125 in
3.18 mm
UL94 V-0
Beryllium Copper
Gold
40
Through Hole
0.25 µm
10 µin
15.24 mm
0.6 in
DIP
10 Áin
0.25 çm
Brass
0.1 in
2.54 mm
Solder
Polyamide (PA46)
Nylon 4/6
Glass Filled
0.1 "
2.54 mm
Open Frame
Gold
40-6518-10H
Aries Electronics
3 A
0.125 in
3.18 mm
UL94 V-0
Beryllium Copper
Gold
40
Through Hole
0.25 µm
10 µin
15.24 mm
0.6 in
DIP
200 µin
5.08 µm
Brass
0.1 in
2.54 mm
Solder
Polyamide (PA46)
Nylon 4/6
Glass Filled
0.1 "
2.54 mm
Open Frame
Tin

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 6.32
12$ 5.30
36$ 4.91
60$ 4.73
108$ 4.54
252$ 4.28
504$ 4.07
1008$ 3.88
2508$ 3.64
N/A 616$ 5.86

Description

General part information

40-6518 Series

40 (2 x 20) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources