40-6518 Series

Catalog

CONN IC DIP SOCKET 40POS GOLD

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Contact Material - Mating	Contact Finish - Mating	Number of Positions or Pins (Grid)	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type [custom]	Type [custom]	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post [custom]	Pitch - Post	Pitch - Post	Termination	Housing Material	Pitch - Mating	Pitch - Mating	Features	Contact Finish - Post
Aries Electronics 40-6518-11	3 A	0.125 in	3.18 mm	UL94 V-0	Beryllium Copper	Gold	40	Through Hole	0.25 µm	10 µin	15.24 mm	0.6 in	DIP	10 Áin	0.25 çm	Brass	0.1 in	2.54 mm	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Open Frame	Gold
Aries Electronics 40-6518-10	3 A	0.125 in	3.18 mm	UL94 V-0	Beryllium Copper	Gold	40	Through Hole	0.25 µm	10 µin	15.24 mm	0.6 in	DIP	200 µin	5.08 µm	Brass	0.1 in	2.54 mm	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Open Frame	Tin
Aries Electronics 40-6518-11H	3 A	0.125 in	3.18 mm	UL94 V-0	Beryllium Copper	Gold	40	Through Hole	0.25 µm	10 µin	15.24 mm	0.6 in	DIP	10 Áin	0.25 çm	Brass	0.1 in	2.54 mm	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Open Frame	Gold
Aries Electronics 40-6518-10H	3 A	0.125 in	3.18 mm	UL94 V-0	Beryllium Copper	Gold	40	Through Hole	0.25 µm	10 µin	15.24 mm	0.6 in	DIP	200 µin	5.08 µm	Brass	0.1 in	2.54 mm	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Open Frame	Tin