Deep-Dive with AI
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Deep-Dive with AI
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Technical Specifications
Parameters and characteristics for this part
| Specification | 08-3518-00 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 0.25 µm |
| Contact Finish Thickness - Mating | 10 µin |
| Contact Finish Thickness - Post | 200 µin |
| Contact Finish Thickness - Post | 5.08 µm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post [custom] | Brass |
| Current Rating (Amps) | 3 A |
| Features | Open Frame |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Surface Mount |
| Number of Positions or Pins (Grid) | 8 |
| Number of Positions or Pins (Grid) [x] | 2 |
| Number of Positions or Pins (Grid) [y] | 4 |
| Pitch - Mating | 0.1 " |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 0.1 in |
| Pitch - Post | 2.54 mm |
| Termination | Solder |
| Termination Post Length | 0.125 in |
| Termination Post Length | 3.18 mm |
| Type | 7.62 mm |
| Type | 0.3 in |
| Type | DIP |
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Material Flammability Rating | Contact Material - Mating | Contact Material - Post [custom] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish - Mating | Type | Type | Type | Mounting Type | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) [y] | Pitch - Mating | Pitch - Mating | Features | Termination | Housing Material | Pitch - Post | Pitch - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 3 A | 0.125 in | 3.18 mm | UL94 V-0 | Beryllium Copper | Brass | 200 µin | 5.08 µm | 0.25 µm | 10 µin | Tin | Gold | 7.62 mm | 0.3 in | DIP | Through Hole | 8 | 2 | 4 | 0.1 " | 2.54 mm | Open Frame | Solder | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm |
Aries Electronics | 3 A | 0.125 in | 3.18 mm | UL94 V-0 | Beryllium Copper | Brass | 10 Áin | 0.25 çm | 0.25 µm | 10 µin | Gold | Gold | 7.62 mm | 0.3 in | DIP | Through Hole | 8 | 2 | 4 | 0.1 " | 2.54 mm | Open Frame | Solder | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm |
 Aries Electronics | 3 A | 0.125 in | 3.18 mm | UL94 V-0 | Beryllium Copper | Brass | 200 µin | 5.08 µm | 0.25 µm | 10 µin | Tin | Gold | 7.62 mm | 0.3 in | DIP | Through Hole | 8 | 2 | 4 | 0.1 " | 2.54 mm | Open Frame | Solder | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm |
Aries Electronics | 3 A | 0.125 in | 3.18 mm | UL94 V-0 | Beryllium Copper | Brass | 200 µin | 5.08 µm | 0.25 µm | 10 µin | Tin | Gold | 7.62 mm | 0.3 in | DIP | Surface Mount | 8 | 2 | 4 | 0.1 " | 2.54 mm | Open Frame | Solder | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | N/A | 8968 | $ 1.96 | |
| Tube | 1 | $ 2.15 | ||
| 10 | $ 1.88 | |||
| 25 | $ 1.80 | |||
| 50 | $ 1.76 | |||
| 100 | $ 1.68 | |||
| 250 | $ 1.52 | |||
| 500 | $ 1.40 | |||
| 1000 | $ 1.20 | |||
| 2500 | $ 1.12 | |||
Description
General part information
08-3518 Series
8 (2 x 4) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Surface Mount
Documents
Technical documentation and resources