08-3518 Series

Catalog

CONN IC DIP SOCKET 8POS GOLD

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Contact Material - Mating	Contact Material - Post [custom]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Contact Finish - Mating	Type	Type	Type	Mounting Type	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Pitch - Mating	Pitch - Mating	Features	Termination	Housing Material	Pitch - Post	Pitch - Post
Aries Electronics 08-3518-10E	3 A	0.125 in	3.18 mm	UL94 V-0	Beryllium Copper	Brass	200 µin	5.08 µm	0.25 µm	10 µin	Tin	Gold	7.62 mm	0.3 in	DIP	Through Hole	8	2	4	0.1 "	2.54 mm	Open Frame	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm
Aries Electronics 08-3518-11H	3 A	0.125 in	3.18 mm	UL94 V-0	Beryllium Copper	Brass	10 Áin	0.25 çm	0.25 µm	10 µin	Gold	Gold	7.62 mm	0.3 in	DIP	Through Hole	8	2	4	0.1 "	2.54 mm	Open Frame	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm
Aries Electronics 08-3518-10	3 A	0.125 in	3.18 mm	UL94 V-0	Beryllium Copper	Brass	200 µin	5.08 µm	0.25 µm	10 µin	Tin	Gold	7.62 mm	0.3 in	DIP	Through Hole	8	2	4	0.1 "	2.54 mm	Open Frame	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm
Aries Electronics 08-3518-00	3 A	0.125 in	3.18 mm	UL94 V-0	Beryllium Copper	Brass	200 µin	5.08 µm	0.25 µm	10 µin	Tin	Gold	7.62 mm	0.3 in	DIP	Surface Mount	8	2	4	0.1 "	2.54 mm	Open Frame	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm