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Technical Specifications
Parameters and characteristics for this part
| Specification | 20-354000-11-RC |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 0.25 µm |
| Contact Finish Thickness - Mating | 10 µin |
| Contact Finish Thickness - Post | 10 Áin |
| Contact Finish Thickness - Post | 0.25 çm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post [custom] | Brass |
| Convert From (Adapter End) | DIP |
| Convert From (Adapter End) [custom] | 0.3 in |
| Convert From (Adapter End) [custom] | 7.62 mm |
| Convert To (Adapter End) | SOIC |
| Current Rating (Amps) | 3 A |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Surface Mount |
| Pitch - Mating | 0.1 " |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 0.05 in |
| Pitch - Post | 1.27 mm |
| Termination | Solder |
| Termination Post Length | 0.03 in |
| Termination Post Length | 0.76 mm |
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Post [custom] | Operating Temperature | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Material Flammability Rating | Current Rating (Amps) | Convert From (Adapter End) [custom] | Convert From (Adapter End) [custom] | Convert From (Adapter End) | Housing Material | Pitch - Mating | Pitch - Mating | Termination | Mounting Type | Contact Finish - Mating | Convert To (Adapter End) | Contact Finish - Post | Pitch - Post | Pitch - Post | Termination Post Length | Termination Post Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.25 µm | 10 µin | Brass | 105 C | 10 Áin | 0.25 çm | Beryllium Copper | UL94 V-0 | 3 A | 0.3 in | 7.62 mm | DIP | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | Solder | Surface Mount | Gold | SOIC | Gold | 0.05 in | 1.27 mm | ||
Aries Electronics | 0.25 µm | 10 µin | Brass | 10 Áin | 0.25 çm | Beryllium Copper | UL94 V-0 | 3 A | 0.3 in | 7.62 mm | DIP | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | Solder | Surface Mount | Gold | SOIC | Gold | 0.05 in | 1.27 mm | 0.089 in | 2.28 mm | |
Aries Electronics | 0.25 µm | 10 µin | Brass | 10 Áin | 0.25 çm | Beryllium Copper | UL94 V-0 | 3 A | 0.3 in | 7.62 mm | DIP | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | Solder | Surface Mount | Gold | SOIC | Gold | 0.05 in | 1.27 mm | 0.03 in | 0.76 mm | |
Aries Electronics | 0.25 µm | 10 µin | Brass | 10 Áin | 0.25 çm | Beryllium Copper | UL94 V-0 | 3 A | 0.3 in | 7.62 mm | DIP | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | Solder | Surface Mount | Gold | SOIC | Gold | 0.05 in | 1.27 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 16 | $ 25.61 | |
| N/A | 0 | $ 33.21 | ||
Description
General part information
20-3540 Series
IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To SOIC Surface Mount
Documents
Technical documentation and resources