20-3540 Series

Catalog

CONN ADAPTER 20POS DIP-SOIC

Part	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post [custom]	Operating Temperature	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Material Flammability Rating	Current Rating (Amps)	Convert From (Adapter End) [custom]	Convert From (Adapter End) [custom]	Convert From (Adapter End)	Housing Material	Pitch - Mating	Pitch - Mating	Termination	Mounting Type	Contact Finish - Mating	Convert To (Adapter End)	Contact Finish - Post	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length
Aries Electronics 20-354000-10	0.25 µm	10 µin	Brass	105 C	10 Áin	0.25 çm	Beryllium Copper	UL94 V-0	3 A	0.3 in	7.62 mm	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Solder	Surface Mount	Gold	SOIC	Gold	0.05 in	1.27 mm
Aries Electronics 20-354000-21-RC	0.25 µm	10 µin	Brass		10 Áin	0.25 çm	Beryllium Copper	UL94 V-0	3 A	0.3 in	7.62 mm	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Solder	Surface Mount	Gold	SOIC	Gold	0.05 in	1.27 mm	0.089 in	2.28 mm
Aries Electronics 20-354000-11-RC	0.25 µm	10 µin	Brass		10 Áin	0.25 çm	Beryllium Copper	UL94 V-0	3 A	0.3 in	7.62 mm	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Solder	Surface Mount	Gold	SOIC	Gold	0.05 in	1.27 mm	0.03 in	0.76 mm
Aries Electronics 20-354000-20	0.25 µm	10 µin	Brass		10 Áin	0.25 çm	Beryllium Copper	UL94 V-0	3 A	0.3 in	7.62 mm	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Solder	Surface Mount	Gold	SOIC	Gold	0.05 in	1.27 mm