Specification	FSB50660SFS

Configuration	3 Phase
Current	3.1 A
Mounting Type	Surface Mount
Package / Case	23-PowerSMD Module, Gull Wing
Type	MOSFET
Voltage	600 V
Voltage - Isolation	1500 VAC

FSB50660SFT Series

Intelligent Power Module (IPM), Motion Control

Part	Type	Voltage	Voltage - Isolation	Configuration	Mounting Type	Package / Case	Current	Package / Case [x]	Package / Case [y]
ON Semiconductor FSB50660SFS	MOSFET	600 V	1500 VAC	3 Phase	Surface Mount	23-PowerSMD Module Gull Wing	3.1 A
ON Semiconductor FSB50660SFT	MOSFET	600 V	1500 VAC	3 Phase	Through Hole	23-PowerDIP Module	3.1 A	0.748 in	19 mm
ON Semiconductor FSB50660SFT	MOSFET	600 V	1500 VAC	3 Phase	Through Hole	23-PowerDIP Module	3.1 A	0.748 in	19 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

FSB50660SFT Series

FSB50660SF and FSB50660SFT are power modules for motion control, SuperFET Series Based on Super Junction MOSFET (SuperFET) Technology as a Compact Inverter Solutionfor Small Power Motor Drive Applications Such as Refrigerators, Fans and Pumps. FSB50660SF and FSB50660SFT Contains Six SuperFET MOSFETs, Three Half-Bridge Gate Drive HVICs with Temperature Sensing, and Three Bootstrap Diodes in a Compact Package Fully Isolated and Optimized for Thermal Performance. Especially, Adopted SuperFET MOSFETs have Fast Trr Characteristics for Body-Diode. FSB50660SF and FSB50660SFT Features Low Electromagnetic Interference(EMI) Characteristics Through Optimizing Switching Speed and Reducing Parasitic Inductance. Since FSB50660SF and FSB50660SFT Employs MOSFETs as Power Switches, It Povides Much More Ruggedness and Larger Safe Operating Area (SOA) than IGBT-Based Power Modules. FSB50660SF and FSB50660SFT are the Right Solution for Compact and Reliable Inverter Designs Where the Assembly Space is Constrained.