RF and Wireless

81-02-11818-2000

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RFI FINGERSTOCK BECU UNPLAT ADH

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RF and Wireless

Active

RFI FINGERSTOCK BECU UNPLAT ADH

Technical Specifications

Parameters and characteristics for this part

Part	Length	Length	Operating Temperature [Max]	Operating Temperature [Min]	Material	Plating	Attachment Method	Width [x]	Width [x]	Type	Height	Height	Height [z]	Height [z]	Width	Width	Length [x]	Length [x]	Width [y]	Width [y]
Parker Chomerics 81-02-14274-2000	15.984 in	406 mm	121 C	-40 C	Beryllium Copper	Unplated	Adhesive	0.45 in	11.43 mm	Fingerstock	1.52 mm	0.06 in
Parker Chomerics 81-02-14449-2000	15.984 in	406 mm	121 C	-40 C	Beryllium Copper	Unplated	Adhesive			Fingerstock			3.05 mm	0.12 in	12.7 mm	0.5 in
Parker Chomerics 81-02-14308-2000			121 C	-40 C	Beryllium Copper	Unplated	Adhesive			Fingerstock			5.59 mm	0.22 in			457 mm	17.992 in	0.6 in	15.24 mm
Parker Chomerics 81-02-14306-2000	15.984 in	406 mm	121 C	-40 C	Beryllium Copper	Unplated	Adhesive			Fingerstock	3.33 mm	0.131 "			9.4 mm	0.37 in
Parker Chomerics 81-02-11818-2000	15.984 in	406 mm	121 C	-40 C	Beryllium Copper	Unplated	Adhesive	0.228 in		Fingerstock			0.76 mm	0.03 in	5.8 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly