81-02 Series

Part	Length	Operating Temperature (Min)	Operating Temperature (Max)	Material	Plating	Attachment Method	Width	Type	Height
Parker Chomerics 81-02-14274-2000	15.984 in	-40 °C	121 °C	Beryllium Copper	Unplated	Adhesive	0.45 in	Fingerstock	0.06 in
Parker Chomerics 81-02-14449-2000	15.984 in	-40 °C	121 °C	Beryllium Copper	Unplated	Adhesive	12.7 mm	Fingerstock	0.12 in
Parker Chomerics 81-02-14308-2000	17.992 in	-40 °C	121 °C	Beryllium Copper	Unplated	Adhesive	0.6 in	Fingerstock	0.22 in
Parker Chomerics 81-02-14306-2000	15.984 in	-40 °C	121 °C	Beryllium Copper	Unplated	Adhesive	0.37 in	Fingerstock	0.131 in
Parker Chomerics 81-02-11818-2000	15.984 in	-40 °C	121 °C	Beryllium Copper	Unplated	Adhesive	0.228 in	Fingerstock	0.03 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$	Updated

Digikey	Tube	250	$ 17.00	<2d

3D models and CAD resources for this part

General part information

RFI FINGERSTOCK BECU UNPLAT ADH

Technical documentation and resources