81-02 Series

Catalog

RFI FINGERSTOCK BECU UNPLAT ADH

Part	Length	Operating Temperature (Min)	Operating Temperature (Max)	Material	Plating	Attachment Method	Width	Type	Height
Parker Chomerics 81-02-14274-2000	15.984 in	-40 °C	121 °C	Beryllium Copper	Unplated	Adhesive	0.45 in	Fingerstock	0.06 in
Parker Chomerics 81-02-14449-2000	15.984 in	-40 °C	121 °C	Beryllium Copper	Unplated	Adhesive	12.7 mm	Fingerstock	0.12 in
Parker Chomerics 81-02-14308-2000	17.992 in	-40 °C	121 °C	Beryllium Copper	Unplated	Adhesive	0.6 in	Fingerstock	0.22 in
Parker Chomerics 81-02-14306-2000	15.984 in	-40 °C	121 °C	Beryllium Copper	Unplated	Adhesive	0.37 in	Fingerstock	0.131 in
Parker Chomerics 81-02-11818-2000	15.984 in	-40 °C	121 °C	Beryllium Copper	Unplated	Adhesive	0.228 in	Fingerstock	0.03 in