81-02 Series
Manufacturer: Parker Chomerics
RFI FINGERSTOCK BECU UNPLAT ADH
| Part | Length | Length | Operating Temperature [Max] | Operating Temperature [Min] | Material | Plating | Attachment Method | Width [x] | Width [x] | Type | Height | Height | Height [z] | Height [z] | Width | Width | Length [x] | Length [x] | Width [y] | Width [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Parker Chomerics | 15.984 in | 406 mm | 121 C | -40 C | Beryllium Copper | Unplated | Adhesive | 0.45 in | 11.43 mm | Fingerstock | 1.52 mm | 0.06 in | ||||||||
Parker Chomerics | 15.984 in | 406 mm | 121 C | -40 C | Beryllium Copper | Unplated | Adhesive | Fingerstock | 3.05 mm | 0.12 in | 12.7 mm | 0.5 in | ||||||||
Parker Chomerics | 121 C | -40 C | Beryllium Copper | Unplated | Adhesive | Fingerstock | 5.59 mm | 0.22 in | 457 mm | 17.992 in | 0.6 in | 15.24 mm | ||||||||
Parker Chomerics | 15.984 in | 406 mm | 121 C | -40 C | Beryllium Copper | Unplated | Adhesive | Fingerstock | 3.33 mm | 0.131 " | 9.4 mm | 0.37 in | ||||||||
Parker Chomerics | 15.984 in | 406 mm | 121 C | -40 C | Beryllium Copper | Unplated | Adhesive | 0.228 in | Fingerstock | 0.76 mm | 0.03 in | 5.8 mm |