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Connectors, Interconnects

48-6518-10M

Active
Aries Electronics

CONN IC DIP SOCKET 48POS GOLD

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DocumentsDatasheet
Connectors, Interconnects

48-6518-10M

Active
Aries Electronics

CONN IC DIP SOCKET 48POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification48-6518-10M
Contact Finish - MatingGold
Contact Finish - PostTin
Contact Finish Thickness - Mating10 çin
Contact Finish Thickness - Mating0.25 çm
Contact Finish Thickness - Post200 µin
Contact Finish Thickness - Post5.08 µm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)3 A
FeaturesOpen Frame
Housing MaterialGlass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)48
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationSolder
Termination Post Length3.18 mm
Termination Post Length0.125 in
TypeDIP
Type0.6 in
Type15.24 mm

48-6518 Series

PartContact Finish Thickness - MatingContact Finish Thickness - MatingPitch - PostPitch - PostContact Material - Post [custom]Termination Post LengthTermination Post LengthPitch - MatingPitch - MatingContact Finish - PostContact Material - MatingCurrent Rating (Amps)TypeTypeTypeMaterial Flammability RatingTerminationNumber of Positions or Pins (Grid)Contact Finish Thickness - PostContact Finish Thickness - PostHousing MaterialMounting TypeContact Finish - MatingFeatures
48-6518-10
Aries Electronics
10 çin
0.25 çm
2.54 mm
0.1 in
Brass
3.18 mm
0.125 in
0.1 in
2.54 mm
Tin
Beryllium Copper
3 A
DIP
0.6 in
15.24 mm
UL94 V-0
Solder
48
200 µin
5.08 µm
Glass Filled
Nylon 4/6
Polyamide (PA46)
Through Hole
Gold
Open Frame
Aries Electronics
10 çin
0.25 çm
2.54 mm
0.1 in
Brass
3.18 mm
0.125 in
0.1 in
2.54 mm
Tin
Beryllium Copper
3 A
DIP
0.6 in
15.24 mm
UL94 V-0
Solder
48
200 µin
5.08 µm
Glass Filled
Nylon 4/6
Polyamide (PA46)
Through Hole
Gold
Open Frame
Aries Electronics
10 çin
0.25 çm
2.54 mm
0.1 in
Brass
3.18 mm
0.125 in
0.1 in
2.54 mm
Gold
Beryllium Copper
3 A
DIP
0.6 in
15.24 mm
UL94 V-0
Solder
48
10 çin
0.25 çm
Glass Filled
Nylon 4/6
Polyamide (PA46)
Through Hole
Gold
Open Frame
Aries Electronics
10 çin
0.25 çm
2.54 mm
0.1 in
Brass
3.18 mm
0.125 in
0.1 in
2.54 mm
Tin
Beryllium Copper
3 A
DIP
0.6 in
15.24 mm
UL94 V-0
Solder
48
200 µin
5.08 µm
Glass Filled
Nylon 4/6
Polyamide (PA46)
Through Hole
Gold
Open Frame
Aries Electronics
10 çin
0.25 çm
2.54 mm
0.1 in
Brass
3.18 mm
0.125 in
0.1 in
2.54 mm
Tin
Beryllium Copper
3 A
DIP
0.6 in
15.24 mm
UL94 V-0
Solder
48
200 µin
5.08 µm
Glass Filled
Nylon 4/6
Polyamide (PA46)
Through Hole
Gold
Open Frame
Aries Electronics
10 çin
0.25 çm
2.54 mm
0.1 in
Brass
3.18 mm
0.125 in
0.1 in
2.54 mm
Gold
Beryllium Copper
3 A
DIP
0.6 in
15.24 mm
UL94 V-0
Solder
48
10 çin
0.25 çm
Glass Filled
Nylon 4/6
Polyamide (PA46)
Through Hole
Gold
Open Frame

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 50$ 10.65

Description

General part information

48-6518 Series

48 (2 x 24) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources