48-6518 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 48POS GOLD
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Mounting Type | Contact Finish - Mating | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Features | Type [custom] | Type [custom] | Type | Pitch - Mating | Pitch - Mating | Contact Material - Post [custom] | Housing Material | Contact Material - Mating | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | Through Hole | Gold | Solder | 200 µin | 5.08 µm | 0.25 µm | 10 µin | Tin | Open Frame | 15.24 mm | 0.6 in | DIP | 0.1 " | 2.54 mm | Brass | Polyamide (PA46) Nylon 4/6 Glass Filled | Beryllium Copper | 0.1 in | 2.54 mm | 2 | 48 | 24 |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | Through Hole | Gold | Solder | 200 µin | 5.08 µm | 0.25 µm | 10 µin | Tin | Open Frame | 15.24 mm | 0.6 in | DIP | 0.1 " | 2.54 mm | Brass | Polyamide (PA46) Nylon 4/6 Glass Filled | Beryllium Copper | 0.1 in | 2.54 mm | 2 | 48 | 24 |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | Through Hole | Gold | Solder | 10 Áin | 0.25 çm | 0.25 µm | 10 µin | Gold | Open Frame | 15.24 mm | 0.6 in | DIP | 0.1 " | 2.54 mm | Brass | Polyamide (PA46) Nylon 4/6 Glass Filled | Beryllium Copper | 0.1 in | 2.54 mm | 2 | 48 | 24 |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | Through Hole | Gold | Solder | 200 µin | 5.08 µm | 0.25 µm | 10 µin | Tin | Open Frame | 15.24 mm | 0.6 in | DIP | 0.1 " | 2.54 mm | Brass | Polyamide (PA46) Nylon 4/6 Glass Filled | Beryllium Copper | 0.1 in | 2.54 mm | 2 | 48 | 24 |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | Through Hole | Gold | Solder | 200 µin | 5.08 µm | 0.25 µm | 10 µin | Tin | Open Frame | 15.24 mm | 0.6 in | DIP | 0.1 " | 2.54 mm | Brass | Polyamide (PA46) Nylon 4/6 Glass Filled | Beryllium Copper | 0.1 in | 2.54 mm | 2 | 48 | 24 |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | Through Hole | Gold | Solder | 10 Áin | 0.25 çm | 0.25 µm | 10 µin | Gold | Open Frame | 15.24 mm | 0.6 in | DIP | 0.1 " | 2.54 mm | Brass | Polyamide (PA46) Nylon 4/6 Glass Filled | Beryllium Copper | 0.1 in | 2.54 mm | 2 | 48 | 24 |