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R6022YNZ4C13
Discrete Semiconductor Products

RGTH00TS65DGC13

Active
Rohm Semiconductor

HIGH-SPEED SWITCHING TYPE, 650V 50A, FRD BUILT-IN, TO-247N, FIELD STOP TRENCH IGBT

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R6022YNZ4C13
Discrete Semiconductor Products

RGTH00TS65DGC13

Active
Rohm Semiconductor

HIGH-SPEED SWITCHING TYPE, 650V 50A, FRD BUILT-IN, TO-247N, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGTH00TS65DGC13
Current - Collector (Ic) (Max) [Max]85 A
Current - Collector Pulsed (Icm)200 A
Gate Charge94 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 C
Package / CaseTO-247-3
Power - Max [Max]277 W
Reverse Recovery Time (trr)54 ns
Supplier Device PackageTO-247G
Td (on/off) @ 25°C143 ns, 39 ns
Test Condition [custom]400 V, 15 V
Test Condition [custom]10 Ohm
Test Condition [custom]50 A
Vce(on) (Max) @ Vge, Ic2.1 V
Voltage - Collector Emitter Breakdown (Max)650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 7.77
10$ 5.27
100$ 3.86
600$ 3.27
NewarkEach 1$ 7.97
1$ 7.97
10$ 5.45
10$ 5.45
25$ 5.44
25$ 5.44
50$ 4.72
50$ 4.72
100$ 3.99
100$ 3.99
250$ 3.94
250$ 3.94

Description

General part information

RGTH00TS65D Series

ROHM's IGBT products will contribute to energy saving high efficiency and a wide range of high voltage and high-current applications.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

About Export Administration Regulations (EAR)

Export Information

PCB Layout Thermal Design Guide

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Create Symbols for PSpice Models

Models

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Compliance of the ELV directive

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

About Flammability of Materials

Environmental Data

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

What Is Thermal Design

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Reliability Test Result

Manufacturing Data

Types and Features of Transistors

Application Note

Simulation Guide for PTC Heater Thermal Simulation (ROHM Solution Simulator)

Simulations

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Moisture Sensitivity Level

Package Information

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Anti-Whisker formation

Package Information

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article