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SCS306AGC16
Discrete Semiconductor Products

SCS306AGC16

Active
Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, SINGLE DUAL CATHODE, 650 V, 6 A, 19 NC, TO-220ACGE

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SCS306AGC16
Discrete Semiconductor Products

SCS306AGC16

Active
Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, SINGLE DUAL CATHODE, 650 V, 6 A, 19 NC, TO-220ACGE

Technical Specifications

Parameters and characteristics for this part

SpecificationSCS306AGC16
Capacitance @ Vr, F300 pF
Current - Average Rectified (Io)6 A
Current - Reverse Leakage @ Vr30 µA
Mounting TypeThrough Hole
Operating Temperature - Junction175 °C
Package / CaseTO-220-2
Reverse Recovery Time (trr)0 ns
Speed500 mA
Supplier Device PackageTO-220ACFP
TechnologySiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max) [Max]650 V
Voltage - Forward (Vf) (Max) @ If1.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1000$ 4.82
NewarkEach 1$ 5.01
10$ 4.20
25$ 3.40
50$ 2.59
100$ 2.36
250$ 2.15
500$ 1.96

Description

General part information

SCS306AG Series

Switching loss reduced, enabling high-speed switching.

Documents

Technical documentation and resources

SCS306AGC16 | Datasheet

Datasheet

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

Diode Types and Applications

Technical Article

How to Use LTspice&reg; Models

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Part Explanation

Application Note

Two-Resistor Model for Thermal Simulation

Thermal Design

About Export Administration Regulations (EAR)

Export Information

Package Dimension - SiC TO-220ACGE

Package Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Compliance of the ELV directive

Environmental Data

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Oscillation countermeasures for MOSFETs in parallel

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Anti-Whisker formation

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Explanation for Marking

Package Information

How to Use Thermal Models

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

What is a Thermal Model? (SiC Power Device)

Thermal Design

Application Note for SiC Power Devices and Modules

Schematic Design & Verification

How to Suppress the Parallel Drive Oscillation in SiC Modules

Application Note

4 Steps for Successful Thermal Designing of Power Devices

White Paper

About Flammability of Materials

Environmental Data

What Is Thermal Design

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article