Specification	JAN2N2605

Current - Collector (Ic) (Max) [Max]	30 mA
Current - Collector Cutoff (Max) [Max]	10 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]	100
Grade	Military
Mounting Type	Through Hole
Package / Case	TO-206AB, TO-46-3 Metal Can
Power - Max [Max]	400 mW
Qualification	MIL-PRF-19500/354
Supplier Device Package	TO-46-3
Transistor Type	PNP
Vce Saturation (Max) @ Ib, Ic	300 mV
Voltage - Collector Emitter Breakdown (Max)	60 V

JAN2N2605-Transistor Series

PNP Silicon Low-Power -60V, -0.03A

Part	Current - Collector (Ic) (Max) [Max]	DC Current Gain (hFE) (Min) @ Ic, Vce [Min]	Current - Collector Cutoff (Max) [Max]	Transistor Type	Mounting Type	Package / Case	Power - Max [Max]	Voltage - Collector Emitter Breakdown (Max)	Supplier Device Package	Vce Saturation (Max) @ Ib, Ic	Qualification	Grade
Microchip Technology 2N2605UB	30 mA	150	10 nA	PNP	Surface Mount	4-SMD No Lead	400 mW	60 V	UB	300 mV
Microchip Technology 2N2605	30 mA	100	10 nA	PNP	Through Hole	TO-206AB TO-46-3 Metal Can	400 mW	60 V	TO-46-3	300 mV
Microchip Technology JAN2N2605	30 mA	100	10 nA	PNP	Through Hole	TO-206AB TO-46-3 Metal Can	400 mW	60 V	TO-46-3	300 mV	MIL-PRF-19500/354	Military

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	100	$ 16.63
Microchip Direct	N/A	1	$ 17.91
Newark	Each	100	$ 16.63
		500	$ 15.99

Description

General part information

JAN2N2605-Transistor Series

This specification covers the performance requirements for PNP, silicon, low-power 2N2604 and 2N2605 transistors for use in low noise level amplifier applications. Four levels of product assurance (JAN, JANTX, JANTXV and JANS) are provided for each encapsulated device type MIL-PRF-19500/354 and two levels of product assurance (JANHC and JANKC) are provided for each unencapsulated device, as specified in MIL-PRF-19500/354. RHA level designators "M", "D", "P", "L", "R", "F’, "G" and "H" are appended to the device prefix to identify devices, which have passed RHA requirements. The device package outlines are as follows: TO-46 in accordance with figure 1, UB suffix in accordance with figure 2 for all encapsulated device types. The dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/354.

Documents

Technical documentation and resources

Product Change Notice EN

Datasheet

2N2604 2N2604UB 2N2605 2N2605UB

Data Sheets