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Discrete Semiconductor Products

2N5238

Active
Microchip Technology

170 V POWER BJT TO-5 ROHS COMPLIANT: YES

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Search across all available documentation for this part.

Discrete Semiconductor Products

2N5238

Active
Microchip Technology

170 V POWER BJT TO-5 ROHS COMPLIANT: YES

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

Specification2N5238
Current - Collector Cutoff (Max) [Max]10 µA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]50
Mounting TypeThrough Hole
Package / CaseTO-205AA, TO-5-3 Metal Can
Power - Max [Max]1 W
Supplier Device PackageTO-5AA
Transistor TypeNPN
Vce Saturation (Max) @ Ib, Ic2.5 V
Voltage - Collector Emitter Breakdown (Max) [Max]170 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 100$ 13.53
Microchip DirectN/A 1$ 14.57
NewarkEach 100$ 13.53
500$ 13.01

Description

General part information

JANTX2N5238S-Transistor Series

This specification covers the performance requirements for NPN, silicon, low-power, high voltage radiation hardened 2N4150, 2N5237 and 2N5238 transistors. Four levels of product assurance (JAN, JANTX, JANTXV, and JANS) are provided for each encapsulated device type as specified in MIL-PRF-19500/394. Two levels of product assurance are provided for each unencapsulated device type (JANHC and JANKC). Provisions for radiation hardness assurance (RHA) to eight radiation levels is provided for JANHC and JANKC product assurance levels. RHA level designators "M", "D", "P", "L", "R", "F", "G", and "H" are appended to the device prefix to identify devices, which have passed RHA requirements. The device package outlines are as follows: TO-5 and surfacemount U3 for all encapsulated device types. The dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/394.

Documents

Technical documentation and resources