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256 FBGA
Integrated Circuits (ICs)

APA300-FGG256M

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Microchip Technology

ULTRA LOW DENSITY FPGAS

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256 FBGA
Integrated Circuits (ICs)

APA300-FGG256M

Active
Microchip Technology

ULTRA LOW DENSITY FPGAS

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationAPA300-FGG256M
Mounting TypeSurface Mount
Number of Gates300000
Number of I/O186
Operating Temperature [Max]125 °C
Operating Temperature [Min]-55 °C
Package / Case256-LBGA
Supplier Device Package256-FPBGA (17x17)
Total RAM Bits73728
Voltage - Supply [Max]2.7 V
Voltage - Supply [Min]2.3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 90$ 639.84
Microchip DirectTRAY 1$ 639.84
50$ 631.07
250$ 614.26
500$ 590.64
1000$ 365.63
5000$ 349.02

Description

General part information

APA300 Series

The

ProASICPLUS family of devices, combines the advantages of ASICs with the

benefits of programmable devices through nonvolatile flash technology.

Documents

Technical documentation and resources

No documents available