APA300 Series

Ultra Low Density FPGAs

Catalog

Ultra Low Density FPGAs

Part	Package / Case	Voltage - Supply [Min]	Voltage - Supply [Max]	Total RAM Bits	Supplier Device Package	Number of Gates	Operating Temperature [Min]	Operating Temperature [Max]	Number of I/O	Mounting Type
Microchip Technology APA300-PQG208A	208-BFQFP	2.375 V	2.625 V	73728	208-PQFP (28x28)	300000	-40 °C	125 ¯C	158	Surface Mount
Microchip Technology APA300-FG144M	144-LBGA	2.3 V	2.7 V	73728	13x13 144-FPBGA	300000	-55 °C	125 °C	100 I/O	Surface Mount
Microchip Technology APA300-PQ208A	208-BFQFP	2.375 V	2.625 V	73728	208-PQFP (28x28)	300000	-40 °C	125 ¯C	158	Surface Mount
Microchip Technology APA300-PQ208I	208-BFQFP	2.3 V	2.7 V	73728	208-PQFP (28x28)	300000	-40 °C	85 °C	158	Surface Mount
Microchip Technology APA300-CQ208B	208-BFCQFP with Tie Bar	2.3 V	2.7 V	73728	208-CQFP (75x75)	300000	-55 °C	125 ¯C	158	Surface Mount
Microchip Technology APA300-FGG256	256-LBGA	2.3 V	2.7 V	73728	256-FPBGA (17x17)	300000	0 °C	70 °C	186	Surface Mount
Microchip Technology APA300-FGG256M	256-LBGA	2.3 V	2.7 V	73728	256-FPBGA (17x17)	300000	-55 °C	125 °C	186	Surface Mount
Microchip Technology APA300-BG456M	456-BBGA	2.3 V	2.7 V	73728		300000	-55 °C	125 °C	290	Surface Mount
Microchip Technology APA300-PQG208M	208-BFQFP	2.3 V	2.7 V	73728	208-PQFP (28x28)	300000	-55 °C	125 °C	158	Surface Mount
Microchip Technology APA300-FG256A	256-LBGA	2.375 V	2.625 V	73728	256-FPBGA (17x17)	300000	-40 °C	125 ¯C	186	Surface Mount

Catalog

Ultra Low Density FPGAs

Key Features

• * 2.7K logic elements

• * 72Kb RAM

• * 2 PLL in CCC

• * PCI

• * Temperature - Commercial, Industrial, Automotive, Military

Description

The ProASICPLUS family of devices, combines the advantages of ASICs with the benefits of programmable devices through nonvolatile flash technology. Key Features • Reprogrammable • Nonvolatile • Live at power-up • ASIC design flow • Very low power • PLLs and LVPECL I/O