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LITTELFUSE LJ6008D8TP
Discrete Semiconductor Products

RF601BM2DFHTL

Active
Rohm Semiconductor

SUPER FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)

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Search across all available documentation for this part.

LITTELFUSE LJ6008D8TP
Discrete Semiconductor Products

RF601BM2DFHTL

Active
Rohm Semiconductor

SUPER FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationRF601BM2DFHTL
Current - Average Rectified (Io) (per Diode)6 A
Current - Reverse Leakage @ Vr10 µA
Diode Configuration1 Pair Common Cathode
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction150 °C
Package / CaseSC-63, DPAK (2 Leads + Tab), TO-252-3
QualificationAEC-Q101
Reverse Recovery Time (trr)25 ns
Speed200 mA, 500 ns
Supplier Device PackageTO-252
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]200 V
Voltage - Forward (Vf) (Max) @ If930 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.10
10$ 0.90
100$ 0.70
500$ 0.59
1000$ 0.48
Digi-Reel® 1$ 1.10
10$ 0.90
100$ 0.70
500$ 0.59
1000$ 0.48
Tape & Reel (TR) 2500$ 0.41
NewarkEach (Supplied on Cut Tape) 1$ 1.13
10$ 0.93
25$ 0.84
50$ 0.75
100$ 0.67
300$ 0.60
500$ 0.53
1000$ 0.49

Description

General part information

RF601BM2DFH Series

RF601BM2DFH is the silicon epitaxial planar type Fast Recovery Diode.

Documents

Technical documentation and resources

TO252 TL Taping Spec

Datasheet

Diode Flammability

Related Document

AEC-Q101 Automotive Requirements

Related Document

TO-252 Part Marking

Related Document

Condition of Soldering / Land Pattern Reference

Package Information

Moisture Sensitivity Level - Diodes

Package Information

ESD Data

Characteristics Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Select Rectifier Diodes

Technical Article

PCB Layout Thermal Design Guide

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Diode Types and Applications

Technical Article

Judgment Criteria of Thermal Evaluation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Reliability Test Result

Manufacturing Data

List of Diode Package Thermal Resistance

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

RF601BM2DFH Data Sheet

Data Sheet

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Part Explanation

Application Note

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

About Export Regulations

Export Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Inner Structure

Package Information

What Is Thermal Design

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Package Dimensions

Package Information