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Discrete Semiconductor Products

RF601T2DNZC9

Active
Rohm Semiconductor

RECTIFIER, 200V, 6A, TO-220FN ROHS COMPLIANT: YES

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsJudgment Criteria of Thermal EvaluationHow to Use LTspice® Models: Tips for Improving Convergence+31
Product dimension image
Discrete Semiconductor Products

RF601T2DNZC9

Active
Rohm Semiconductor

RECTIFIER, 200V, 6A, TO-220FN ROHS COMPLIANT: YES

Deep-Dive with AI

DocumentsJudgment Criteria of Thermal EvaluationHow to Use LTspice® Models: Tips for Improving Convergence+31

Technical Specifications

Parameters and characteristics for this part

SpecificationRF601T2DNZC9
Current - Average Rectified (Io) (per Diode)6 A
Current - Reverse Leakage @ Vr10 µA
Diode Configuration1 Pair Common Cathode
Mounting TypeThrough Hole
Operating Temperature - Junction150 ¯C
Package / CaseTO-220-3 Full Pack
Reverse Recovery Time (trr)25 ns
Speed200 mA, 500 ns
Supplier Device PackageTO-220FN
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]200 V
Voltage - Forward (Vf) (Max) @ If930 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 1.27
50$ 0.61
100$ 0.54
500$ 0.46
NewarkEach 1$ 1.70
10$ 0.86
100$ 0.77
500$ 0.61
1000$ 0.51
3000$ 0.49
10000$ 0.47

Description

General part information

RF601BM2DFH Series

RF601BM2DFH is the silicon epitaxial planar type Fast Recovery Diode.

Documents

Technical documentation and resources

Judgment Criteria of Thermal Evaluation

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

RF601T2DNZ ESD Data

Characteristics Data

Diode Types and Applications

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Explanation for Marking

Package Information

How to Select Rectifier Diodes

Technical Article

Inner Structure

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

What Is Thermal Design

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Package Dimensions

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Part Explanation

Application Note

Power Loss and Thermal Design of Diodes

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

What is a Thermal Model? (Diode)

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

About Export Regulations

Export Information

Taping Information

Package Information