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WLCSP16_SOT8087
Discrete Semiconductor Products

GANB8R0-040CBAZ

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Nexperia USA Inc.

40 V, 8.0 MOHM BI-DIRECTIONAL GALLIUM NITRIDE (GAN) FET IN A 1.7 MM X 1.7 MM WAFER LEVEL CHIP-SCALE PACKAGE (WLCSP)

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WLCSP16_SOT8087
Discrete Semiconductor Products

GANB8R0-040CBAZ

Active
Nexperia USA Inc.

40 V, 8.0 MOHM BI-DIRECTIONAL GALLIUM NITRIDE (GAN) FET IN A 1.7 MM X 1.7 MM WAFER LEVEL CHIP-SCALE PACKAGE (WLCSP)

Technical Specifications

Parameters and characteristics for this part

SpecificationGANB8R0-040CBAZ
Current - Continuous Drain (Id) @ 25°C14 A
Drain to Source Voltage (Vdss)40 V
Drive Voltage (Max Rds On, Min Rds On)5 V
FET TypeN-Channel
Input Capacitance (Ciss) (Max) @ Vds566 pF
Mounting TypeSurface Mount
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 C
Package / Case16-UFBGA, WLCSP
Power Dissipation (Max)15 W
Rds On (Max) @ Id, Vgs8 mOhm
Supplier Device Package16-WLCSP
Supplier Device Package [x]1.7
Supplier Device Package [y]1.7
TechnologyGaNFET (Gallium Nitride)
Vgs (Max) [Max]6 V
Vgs(th) (Max) @ Id2.4 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2327$ 2.84

Description

General part information

GANB8R0-040CBA Series

The GANB8R0-040CBA is a 40 V, 8.0 mΩ bi-directional Gallium Nitride (GaN) High Electron-Mobility-Transistor (HEMT) in a Wafer Level Chip-Scale (WLCSP) package. It is a normally-off e-mode device offering superior performance.