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Technical Specifications
Parameters and characteristics for this part
| Specification | HMC292LC3BTR-R5 |
|---|---|
| Frequency [Max] | 30 GHz |
| Frequency [Min] | 16 GHz |
| Mounting Type | Surface Mount |
| Noise Figure | 9.5 dB |
| Number of Mixers | 1 |
| Package / Case | 12-VFCQFN Exposed Pad |
| RF Type | General Purpose |
| Secondary Attributes | Up/Down Converter |
| Supplier Device Package | 12-CSMT (3x3) |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
Description
General part information
HMC292 Series
The HMC292 devices are passive GaAs MMIC double-balanced mixers that can be used as downconverters or upconverters. They are available in a chip (HMC292), a leadless RoHS compliant SMT package (HMC292LC3B), and an SMT leadless chip carrier package (HMC292LM3C). The HMC292 is used as a downconverter or upconverter in a small chip area of 0.66 mm2. Excellent isolations are provided by on-chip baluns, which require no external components and no dc bias. All data on the HMC292 is measured with the chip in a 50 Ω test fixture connected via 0.076 mm (3 mil) ribbon bonds of minimal length less than 0.31 mm (<12 mils). The HMC292LC3B operates with LO drive levels greater than 9 dBm. All data on the HMC292LM3C is with the nonhermetic, epoxy sealed LM3C packaged device mounted in a 50 Ω test fixture. Utilizing the HMC292LC3B or HMC292LM3C eliminates the need for wire bonding, allowing use of surface mount manufacturing techniques.ApplicationsMicrowave point-to-point radiosPoint-to-point radiosPoint-to-multipoint radios and very small aperture terminal (VSAT)Local multipoint distribution systems (LMDS)Satellite communications (SATCOM)Test equipment and sensorsMilitary end use
Documents
Technical documentation and resources