Catalog
HMC292 / HMC292LC3B / HMC292LM3C
Key Features
• Input IP3HMC292: 19 dBmHMC292LC3B: 21 dBmHMC292LM3C: 19 dBm
• Local oscillator (LO) to radio frequency (RF) isolationHMC292: 38 dBHMC292LC3B: 40 dBHMC292LM3C: 25 dB to 40 dB
• Passive: no dc bias required
• Small size (HMC292): 1.04 mm × 0.58 mm × 0.1 mm
• Wide intermediate frequency (IF) bandwidth (HMC292LC3B): dc to 8 GHz
• Robust 1,000 V electrostatic discharge (ESD), Class 1C (HMC292LC2B)
• 12-Lead ceramic 3 mm × 3 mm SMT package (HMC292LC3B): 9 mm2
• Leadless SMT package, 25 mm2 (HMC292LM3C)
Description
AI
The HMC292 devices are passive GaAs MMIC double-balanced mixers that can be used as downconverters or upconverters. They are available in a chip (HMC292), a leadless RoHS compliant SMT package (HMC292LC3B), and an SMT leadless chip carrier package (HMC292LM3C). The HMC292 is used as a downconverter or upconverter in a small chip area of 0.66 mm2. Excellent isolations are provided by on-chip baluns, which require no external components and no dc bias. All data on the HMC292 is measured with the chip in a 50 Ω test fixture connected via 0.076 mm (3 mil) ribbon bonds of minimal length less than 0.31 mm (<12 mils). The HMC292LC3B operates with LO drive levels greater than 9 dBm. All data on the HMC292LM3C is with the nonhermetic, epoxy sealed LM3C packaged device mounted in a 50 Ω test fixture. Utilizing the HMC292LC3B or HMC292LM3C eliminates the need for wire bonding, allowing use of surface mount manufacturing techniques.ApplicationsMicrowave point-to-point radiosPoint-to-point radiosPoint-to-multipoint radios and very small aperture terminal (VSAT)Local multipoint distribution systems (LMDS)Satellite communications (SATCOM)Test equipment and sensorsMilitary end use
