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Integrated Circuits (ICs)

TLV5632IDWR

Active
Texas Instruments

8-BIT 8-CH. 1/3 US DAC, SER. INPUT, PGRMABLE SETTLING TIME/POWER CONSUMP, LOW POWER, PWRDN, INT REF

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20-SOIC
Integrated Circuits (ICs)

TLV5632IDWR

Active
Texas Instruments

8-BIT 8-CH. 1/3 US DAC, SER. INPUT, PGRMABLE SETTLING TIME/POWER CONSUMP, LOW POWER, PWRDN, INT REF

Technical Specifications

Parameters and characteristics for this part

SpecificationTLV5632IDWR
ArchitectureString DAC
Data InterfaceSPI
Differential OutputFalse
INL/DNL (LSB)0.1 LSB, 0.3 LSB
Mounting TypeSurface Mount
Number of Bits8
Number of D/A Converters8
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Output TypeVoltage - Buffered
Package / Case20-SOIC
Package / Case [y]0.295 in
Package / Case [y]7.5 mm
Reference TypeExternal, Internal
Settling Time7 µs
Supplier Device Package20-SOIC
Voltage - Supply, Analog5 V
Voltage - Supply, Analog [Max]3.3 V
Voltage - Supply, Analog [Min]2.7 V
Voltage - Supply, Digital5 V
Voltage - Supply, Digital [Max]3.3 V
Voltage - Supply, Digital [Min]2.7 V

TLV5632 Series

8-Bit 8-Ch. 1/3 us DAC, Ser. Input, Pgrmable Settling Time/Power Consump, Low Power, PwrDn, Int Ref

PartPackage / Case [y]Package / CasePackage / Case [x]Data InterfaceMounting TypeReference TypeINL/DNL (LSB)Number of D/A ConvertersVoltage - Supply, AnalogVoltage - Supply, Analog [Max]Voltage - Supply, Analog [Min]Operating Temperature [Max]Operating Temperature [Min]Settling TimeArchitectureVoltage - Supply, Digital [Min]Voltage - Supply, DigitalVoltage - Supply, Digital [Max]Supplier Device PackageNumber of BitsOutput TypeDifferential OutputPackage / Case [y]
20-pin (PW) package image
Texas Instruments
4.4 mm
20-TSSOP
0.173 in
SPI
Surface Mount
External
Internal
0.1 LSB
0.3 LSB
8
5 V
3.3 V
2.7 V
85 °C
-40 °C
7 µs
String DAC
2.7 V
5 V
3.3 V
20-TSSOP
8
Voltage - Buffered
20-TSSOP
Texas Instruments
4.4 mm
20-TSSOP
0.173 in
SPI
Surface Mount
External
Internal
0.1 LSB
0.3 LSB
8
5 V
3.3 V
2.7 V
85 °C
-40 °C
7 µs
String DAC
2.7 V
5 V
3.3 V
20-TSSOP
8
Voltage - Buffered
20-SOIC
Texas Instruments
0.295 in
20-SOIC
SPI
Surface Mount
External
Internal
0.1 LSB
0.3 LSB
8
5 V
3.3 V
2.7 V
85 °C
-40 °C
7 µs
String DAC
2.7 V
5 V
3.3 V
20-SOIC
8
Voltage - Buffered
7.5 mm
SOIC (DW)
Texas Instruments
0.295 in
20-SOIC
SPI
Surface Mount
External
Internal
0.1 LSB
0.3 LSB
8
5 V
3.3 V
2.7 V
85 °C
-40 °C
7 µs
String DAC
2.7 V
5 V
3.3 V
20-SOIC
8
Voltage - Buffered
7.5 mm
20-TSSOP
Texas Instruments
4.4 mm
20-TSSOP
0.173 in
SPI
Surface Mount
External
Internal
0.1 LSB
0.3 LSB
8
5 V
3.3 V
2.7 V
85 °C
-40 °C
7 µs
String DAC
2.7 V
5 V
3.3 V
20-TSSOP
8
Voltage - Buffered

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTape & Reel (TR) 2000$ 5.56
Texas InstrumentsLARGE T&R 1$ 7.80
100$ 6.36
250$ 5.00
1000$ 4.24

Description

General part information

TLV5632 Series

The TLV5630, TLV5631, and TLV5632 are pin-compatible, eight-channel, 12-/10-/8-bit voltage output DACs each with a flexible serial interface. The serial interface allows glueless interface to TMS320 and SPI, QSPI, and Microwire serial ports. It is programmed with a 16-bit serial string containing 4 control and 12 data bits.

Additional features are a power-down mode, anLDACinput for simultaneous update of all eight DAC outputs, and a data output which can be used to cascade multiple devices, and an internal programmable band-gap reference.

The resistor string output voltage is buffered by a rail-to-rail output amplifier with a programmable settling time to allow the designer to optimize speed vs power dissipation. The buffered, high-impedance reference input can be connected to the supply voltage.