Connectors, Interconnects

264-4493-00-0602J

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IC & COMPONENT SOCKET, 64 CONTACTS, DIP SOCKET, 2.54 MM, 264 SERIES, 22.86 MM, BERYLLIUM COPPER

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Connectors, Interconnects

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IC & COMPONENT SOCKET, 64 CONTACTS, DIP SOCKET, 2.54 MM, 264 SERIES, 22.86 MM, BERYLLIUM COPPER

Technical Specifications

Parameters and characteristics for this part

Specification	264-4493-00-0602J

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Post	30 µin
Contact Finish Thickness - Post	0.76 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polysulfone (PSU), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Connector
Number of Positions or Pins (Grid)	64
Number of Positions or Pins (Grid) [x]	2
Number of Positions or Pins (Grid) [y]	32
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Press-Fit
Termination Post Length	0.11 in
Termination Post Length	2.78 mm
Type	DIP, ZIF, ZIP
Type [custom]	22.86 mm
Type [custom]	0.9 "

Part	Contact Resistance	Termination Post Length	Termination Post Length	Housing Material	Pitch - Post	Pitch - Post	Type	Mounting Type	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Features	Contact Finish - Post	Contact Material - Post	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [x]	Termination	Contact Material - Mating	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Type [custom]	Type [custom]	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
3M Electronic Specialty 264-5205-01	25 mOhm	0.114 "	2.9 mm	Polyethersulfone (PES)	0.5 mm	0.02 in	QFN	Through Hole	Gold	0.5 mm	0.02 in	Open Frame	Gold	Beryllium Copper	16	64	4	Solder	Beryllium Copper
3M Electronic Specialty 264-4493-00-0602J		2.78 mm		Polysulfone (PSU) Glass Filled	2.54 mm	0.1 in	DIP ZIF ZIP	Connector	Gold	2.54 mm	0.1 "	Closed Frame	Gold	Beryllium Copper	32	64	2	Press-Fit	Beryllium Copper	0.11 in	UL94 V-0	1 A	22.86 mm	0.9 "	-55 C	125 °C	30 µin	0.76 µm	0.76 Ám	30 Áin
3M Electronic Specialty 264-4205-00
3M Electronic Specialty 264-1300-00-0602J	15 mOhm	2.78 mm		Polysulfone (PSU) Glass Filled	1.78 mm	0.07 in	DIP ZIF ZIP	Connector	Gold	1.78 mm	0.07 in	Closed Frame	Gold	Beryllium Copper	32	64	2	Press-Fit	Beryllium Copper	0.11 in	UL94 V-0	1 A	22.86 mm	0.9 "	-55 C	125 °C	30 µin	0.76 µm	0.76 Ám	30 Áin

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

64 (2 x 32) Pos DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing Socket Gold Connector