264 Series

Catalog

IC & COMPONENT SOCKET, 64 CONTACTS, QFN TEST SOCKET, 0.5 MM, 264 SERIES, BERYLLIUM COPPER

Part	Contact Resistance	Termination Post Length	Termination Post Length	Housing Material	Pitch - Post	Pitch - Post	Type	Mounting Type	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Features	Contact Finish - Post	Contact Material - Post	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [x]	Termination	Contact Material - Mating	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Type [custom]	Type [custom]	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
3M Electronic Specialty 264-5205-01	25 mOhm	0.114 "	2.9 mm	Polyethersulfone (PES)	0.5 mm	0.02 in	QFN	Through Hole	Gold	0.5 mm	0.02 in	Open Frame	Gold	Beryllium Copper	16	64	4	Solder	Beryllium Copper
3M Electronic Specialty 264-4493-00-0602J		2.78 mm		Polysulfone (PSU) Glass Filled	2.54 mm	0.1 in	DIP ZIF ZIP	Connector	Gold	2.54 mm	0.1 "	Closed Frame	Gold	Beryllium Copper	32	64	2	Press-Fit	Beryllium Copper	0.11 in	UL94 V-0	1 A	22.86 mm	0.9 "	-55 C	125 °C	30 µin	0.76 µm	0.76 Ám	30 Áin
3M Electronic Specialty 264-4205-00
3M Electronic Specialty 264-1300-00-0602J	15 mOhm	2.78 mm		Polysulfone (PSU) Glass Filled	1.78 mm	0.07 in	DIP ZIF ZIP	Connector	Gold	1.78 mm	0.07 in	Closed Frame	Gold	Beryllium Copper	32	64	2	Press-Fit	Beryllium Copper	0.11 in	UL94 V-0	1 A	22.86 mm	0.9 "	-55 C	125 °C	30 µin	0.76 µm	0.76 Ám	30 Áin