Connectors, Interconnects

264-5205-01

Active

IC & COMPONENT SOCKET, 64 CONTACTS, QFN TEST SOCKET, 0.5 MM, 264 SERIES, BERYLLIUM COPPER

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Connectors, Interconnects

Active

IC & COMPONENT SOCKET, 64 CONTACTS, QFN TEST SOCKET, 0.5 MM, 264 SERIES, BERYLLIUM COPPER

Technical Specifications

Parameters and characteristics for this part

Specification	264-5205-01

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Contact Resistance	25 mOhm
Features	Open Frame
Housing Material	Polyethersulfone (PES)
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	64
Number of Positions or Pins (Grid) [x]	4
Number of Positions or Pins (Grid) [y]	16
Pitch - Mating	0.5 mm
Pitch - Mating	0.02 in
Pitch - Post	0.5 mm
Pitch - Post	0.02 in
Termination	Solder
Termination Post Length	0.114 "
Termination Post Length	2.9 mm
Type	QFN

Part	Contact Resistance	Termination Post Length	Termination Post Length	Housing Material	Pitch - Post	Pitch - Post	Type	Mounting Type	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Features	Contact Finish - Post	Contact Material - Post	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [x]	Termination	Contact Material - Mating	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Type [custom]	Type [custom]	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
3M Electronic Specialty 264-5205-01	25 mOhm	0.114 "	2.9 mm	Polyethersulfone (PES)	0.5 mm	0.02 in	QFN	Through Hole	Gold	0.5 mm	0.02 in	Open Frame	Gold	Beryllium Copper	16	64	4	Solder	Beryllium Copper
3M Electronic Specialty 264-4493-00-0602J		2.78 mm		Polysulfone (PSU) Glass Filled	2.54 mm	0.1 in	DIP ZIF ZIP	Connector	Gold	2.54 mm	0.1 "	Closed Frame	Gold	Beryllium Copper	32	64	2	Press-Fit	Beryllium Copper	0.11 in	UL94 V-0	1 A	22.86 mm	0.9 "	-55 C	125 °C	30 µin	0.76 µm	0.76 Ám	30 Áin
3M Electronic Specialty 264-4205-00
3M Electronic Specialty 264-1300-00-0602J	15 mOhm	2.78 mm		Polysulfone (PSU) Glass Filled	1.78 mm	0.07 in	DIP ZIF ZIP	Connector	Gold	1.78 mm	0.07 in	Closed Frame	Gold	Beryllium Copper	32	64	2	Press-Fit	Beryllium Copper	0.11 in	UL94 V-0	1 A	22.86 mm	0.9 "	-55 C	125 °C	30 µin	0.76 µm	0.76 Ám	30 Áin

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

64 (4 x 16) Pos QFN Socket Gold Through Hole

Technical documentation and resources