Fans, Blowers, Thermal Management

WAVE-32-12

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LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES

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Fans, Blowers, Thermal Management

Active

LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

Specification	WAVE-32-12

Attachment Method	Clip
Fin Height	0.472 in
Fin Height	12 mm
Length	32 mm
Length	0.105 ft
Material	Aluminum Alloy
Material Finish	Black Anodized
Package Cooled	BGA
Shape [custom]	Angled Fins
Shape [custom]	Square
Thermal Resistance @ Forced Air Flow	4.64 °C/W
Type	Board Level
Width [y]	32 mm
Width [y]	1.26 "

Part	Thermal Resistance @ Forced Air Flow	Material	Type	Fin Height	Fin Height	Material Finish	Length	Length	Width [y]	Width [y]	Attachment Method	Shape [custom]	Shape [custom]	Package Cooled
Wakefield Thermal Solutions WAVE-32-12	4.64 °C/W	Aluminum Alloy	Board Level	0.472 in	12 mm	Black Anodized	32 mm	0.105 ft	32 mm	1.26 "	Clip	Angled Fins	Square	BGA
Wakefield Thermal Solutions WAVE-32-12	4.64 °C/W	Aluminum Alloy	Board Level	0.472 in	12 mm	Black Anodized	32 mm	0.105 ft	32 mm	1.26 "	Clip	Angled Fins	Square	BGA

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Heat Sink BGA Aluminum Alloy Board Level

Technical documentation and resources