WAVE-32 Series

Catalog

LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES

Part	Thermal Resistance @ Forced Air Flow	Material	Type	Fin Height	Fin Height	Material Finish	Length	Length	Width [y]	Width [y]	Attachment Method	Shape [custom]	Shape [custom]	Package Cooled
Wakefield Thermal Solutions WAVE-32-12	4.64 °C/W	Aluminum Alloy	Board Level	0.472 in	12 mm	Black Anodized	32 mm	0.105 ft	32 mm	1.26 "	Clip	Angled Fins	Square	BGA
Wakefield Thermal Solutions WAVE-32-12	4.64 °C/W	Aluminum Alloy	Board Level	0.472 in	12 mm	Black Anodized	32 mm	0.105 ft	32 mm	1.26 "	Clip	Angled Fins	Square	BGA