Integrated Circuits (ICs)

PL130-07SI-R

Obsolete

Microchip Technology

IC CLK BUFFER 1:1 200MHZ 8SOP

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Integrated Circuits (ICs)

PL130-07SI-R

Obsolete

Microchip Technology

IC CLK BUFFER 1:1 200MHZ 8SOP

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DocumentsDatasheet

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	PL130-07SI-R

Differential - Input:Output	False
Frequency - Max [Max]	200 MHz
Mounting Type	Surface Mount
Number of Circuits	1
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Output	LVCMOS
Package / Case	8-SOIC
Package / Case [x]	0.154 in
Package / Case [y]	3.9 mm
Ratio - Input:Output [custom]	1:1
Supplier Device Package	8-SOP
Type	Buffer/Driver
Voltage - Supply [Max]	3.3 V
Voltage - Supply [Min]	2.5 V

PL130 Series

Part	Voltage - Supply [Max]	Voltage - Supply [Min]	Output	Mounting Type	Package / Case	Package / Case [y]	Package / Case [x]	Number of Circuits	Ratio - Input:Output [custom]	Supplier Device Package	Frequency - Max [Max]	Type	Differential - Input:Output	Operating Temperature [Max]	Operating Temperature [Min]	Input	Package / Case [custom]	Package / Case [custom]
Microchip Technology PL130-09SC	3.63 V	2.25 V	LVDS	Surface Mount	8-SOIC	3.9 mm	0.154 in	1	1:1	8-SOP	1 MHz	Buffer/Driver	No/Yes	70 °C	0 °C	CMOS LVDS PECL Sine Wave TTL
Microchip Technology PL130-07AOC-R	3.3 V	2.5 V	LVCMOS	Surface Mount	8-TSSOP			1	1:1	8-TSSOP	200 MHz	Buffer/Driver		70 °C	0 °C		0.173 "	4.4 mm
Microchip Technology PL130-09QC-R	3.63 V	2.25 V	LVDS	Surface Mount	16-WFQFN Exposed Pad			1	1:1	16-QFN (3x3)	1 MHz	Buffer/Driver	No/Yes	70 °C	0 °C	CMOS LVDS PECL Sine Wave TTL
Microchip Technology PL130-09QI	3.63 V	2.25 V	LVDS	Surface Mount	16-WFQFN Exposed Pad			1	1:1	16-QFN (3x3)	1 MHz	Buffer/Driver	No/Yes	85 °C	-40 °C	CMOS LVDS PECL Sine Wave TTL
Microchip Technology PL130-07SI-R	3.3 V	2.5 V	LVCMOS	Surface Mount	8-SOIC	3.9 mm	0.154 in	1	1:1	8-SOP	200 MHz	Buffer/Driver		85 °C	-40 °C
Microchip Technology PL130-05QC-R	3.3 V	2.5 V	PECL	Surface Mount	16-WFQFN Exposed Pad			1	1:1	16-QFN (3x3)	1 GHz	Buffer/Driver	No/Yes	70 °C	0 °C	CMOS LVDS Sine Wave TTL
Microchip Technology PL130-07SC-R	3.3 V	2.5 V	LVCMOS	Surface Mount	8-SOIC	3.9 mm	0.154 in	1	1:1	8-SOP	200 MHz	Buffer/Driver		70 °C	0 °C
Microchip Technology PL130-09SC-R	3.63 V	2.25 V	LVDS	Surface Mount	8-SOIC	3.9 mm	0.154 in	1	1:1	8-SOP	1 MHz	Buffer/Driver	No/Yes	70 °C	0 °C	CMOS LVDS PECL Sine Wave TTL
Microchip Technology PL130-07SI	3.3 V	2.5 V	LVCMOS	Surface Mount	8-SOIC	3.9 mm	0.154 in	1	1:1	8-SOP	200 MHz	Buffer/Driver		85 °C	-40 °C
Microchip Technology PL130-07QC-R	3.3 V	2.5 V	LVCMOS	Surface Mount	16-WFQFN Exposed Pad			1	1:1	16-QFN (3x3)	200 MHz	Buffer/Driver		70 °C	0 °C

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

PL130 Series

Clock Buffer/Driver IC 1:1 200 MHz 8-SOIC (0.154", 3.90mm Width)

Documents

Technical documentation and resources