PL130 Series

Catalog

IC CLK BUFFER 1:1 1MHZ 8SOP

Part	Voltage - Supply [Max]	Voltage - Supply [Min]	Output	Mounting Type	Package / Case	Package / Case [y]	Package / Case [x]	Number of Circuits	Ratio - Input:Output [custom]	Supplier Device Package	Frequency - Max [Max]	Type	Differential - Input:Output	Operating Temperature [Max]	Operating Temperature [Min]	Input	Package / Case [custom]	Package / Case [custom]
Microchip Technology PL130-09SC	3.63 V	2.25 V	LVDS	Surface Mount	8-SOIC	3.9 mm	0.154 in	1	1:1	8-SOP	1 MHz	Buffer/Driver	No/Yes	70 °C	0 °C	CMOS LVDS PECL Sine Wave TTL
Microchip Technology PL130-07AOC-R	3.3 V	2.5 V	LVCMOS	Surface Mount	8-TSSOP			1	1:1	8-TSSOP	200 MHz	Buffer/Driver		70 °C	0 °C		0.173 "	4.4 mm
Microchip Technology PL130-09QC-R	3.63 V	2.25 V	LVDS	Surface Mount	16-WFQFN Exposed Pad			1	1:1	16-QFN (3x3)	1 MHz	Buffer/Driver	No/Yes	70 °C	0 °C	CMOS LVDS PECL Sine Wave TTL
Microchip Technology PL130-09QI	3.63 V	2.25 V	LVDS	Surface Mount	16-WFQFN Exposed Pad			1	1:1	16-QFN (3x3)	1 MHz	Buffer/Driver	No/Yes	85 °C	-40 °C	CMOS LVDS PECL Sine Wave TTL
Microchip Technology PL130-07SI-R	3.3 V	2.5 V	LVCMOS	Surface Mount	8-SOIC	3.9 mm	0.154 in	1	1:1	8-SOP	200 MHz	Buffer/Driver		85 °C	-40 °C
Microchip Technology PL130-05QC-R	3.3 V	2.5 V	PECL	Surface Mount	16-WFQFN Exposed Pad			1	1:1	16-QFN (3x3)	1 GHz	Buffer/Driver	No/Yes	70 °C	0 °C	CMOS LVDS Sine Wave TTL
Microchip Technology PL130-07SC-R	3.3 V	2.5 V	LVCMOS	Surface Mount	8-SOIC	3.9 mm	0.154 in	1	1:1	8-SOP	200 MHz	Buffer/Driver		70 °C	0 °C
Microchip Technology PL130-09SC-R	3.63 V	2.25 V	LVDS	Surface Mount	8-SOIC	3.9 mm	0.154 in	1	1:1	8-SOP	1 MHz	Buffer/Driver	No/Yes	70 °C	0 °C	CMOS LVDS PECL Sine Wave TTL
Microchip Technology PL130-07SI	3.3 V	2.5 V	LVCMOS	Surface Mount	8-SOIC	3.9 mm	0.154 in	1	1:1	8-SOP	200 MHz	Buffer/Driver		85 °C	-40 °C
Microchip Technology PL130-07QC-R	3.3 V	2.5 V	LVCMOS	Surface Mount	16-WFQFN Exposed Pad			1	1:1	16-QFN (3x3)	200 MHz	Buffer/Driver		70 °C	0 °C