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UMT3
Discrete Semiconductor Products

RJU003N03FRAT106

Active
Rohm Semiconductor

MOSFET, N-CH, 30V, 0.3A, UMT ROHS COMPLIANT: YES

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UMT3
Discrete Semiconductor Products

RJU003N03FRAT106

Active
Rohm Semiconductor

MOSFET, N-CH, 30V, 0.3A, UMT ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationRJU003N03FRAT106
Current - Continuous Drain (Id) @ 25°C300 mA
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On) [Max]2.5 V
Drive Voltage (Max Rds On, Min Rds On) [Min]4.5 V
FET TypeN-Channel
GradeAutomotive
Input Capacitance (Ciss) (Max) @ Vds [Max]24 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-323, SC-70
Power Dissipation (Max)200 mW
QualificationAEC-Q101
Rds On (Max) @ Id, Vgs1.1 Ohm
Supplier Device PackageUMT3
TechnologyMOSFET (Metal Oxide)
Vgs (Max)12 V
Vgs(th) (Max) @ Id1.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.43
10$ 0.27
100$ 0.17
500$ 0.12
1000$ 0.11
Digi-Reel® 1$ 0.43
10$ 0.27
100$ 0.17
500$ 0.12
1000$ 0.11
N/A 23016$ 0.43
Tape & Reel (TR) 3000$ 0.09
6000$ 0.08
9000$ 0.08
15000$ 0.08
21000$ 0.07
30000$ 0.07
75000$ 0.06
150000$ 0.06
MouserN/A 1$ 0.43
10$ 0.26
100$ 0.17
500$ 0.13
1000$ 0.10
3000$ 0.09
6000$ 0.07
9000$ 0.07
24000$ 0.06
NewarkEach (Supplied on Full Reel) 3000$ 0.09
6000$ 0.09
12000$ 0.08
18000$ 0.08
30000$ 0.07

Description

General part information

RJU003 Series

MOSFETs are made as ultra-low ON-resistance by the micro-processing technologies suitable for mobile equipment for low current consumption. In wide lineup including compact type, high-power type and complex type to meet in the market.

Documents

Technical documentation and resources

Taping Information

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

About Export Regulations

Export Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

What is a Thermal Model? (Transistor)

Thermal Design

Reliability Test Result

Manufacturing Data

About Flammability of Materials

Environmental Data

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

RJU003N03FRA Data Sheet

Data Sheet

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

How to Create Symbols for PSpice Models

Models

Explanation for Marking

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Anti-Whisker formation - Transistors

Package Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Moisture Sensitivity Level - Transistors

Package Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Types and Features of Transistors

Application Note

Package Dimensions

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

What Is Thermal Design

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Part Explanation

Application Note

ESD Data

Characteristics Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification