2170630034

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Molex

M-ONE 2.0 ST ASSY 3CKT ETP NAT_G

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Connectors, Interconnects

2170630034

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Molex

M-ONE 2.0 ST ASSY 3CKT ETP NAT_G

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Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	2170630034

Connector Type	Header
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	1 µm
Contact Finish Thickness - Mating	39.4 µin
Contact Finish Thickness - Post	1 çm
Contact Finish Thickness - Post	39.4 çin
Contact Material	Brass
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	Varies by Wire Gauge
Fastening Type	Friction Lock
Features	Solder Retention
Insulation Color	Natural
Insulation Height [z]	9.91 mm
Insulation Height [z]	0.39 in
Insulation Material	Polyamide (PA), Nylon
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-40 °C
Pitch - Mating [x]	0.079 in
Pitch - Mating [x]	2 mm
Shrouding	Shrouded - 4 Wall
Style	Board to Cable/Wire
Termination	Solder
Voltage Rating	250 VAC

217063 Series

Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 6 Circuits, Tin-Bismuth Plating, Natural, with Potting Capability, with Cover Tape

Part	Contact Material	Number of Positions	Voltage Rating	Contact Shape	Pitch - Mating [x]	Pitch - Mating [x]	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Style	Contact Finish - Post	Connector Type	Material Flammability Rating	Insulation Color	Contact Finish - Mating	Insulation Material	Number of Rows	Mounting Type	Features	Contact Type	Number of Positions Loaded	Termination	Insulation Height [z]	Insulation Height [z]	Shrouding	Fastening Type	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Molex 2170630047	Brass	4	250 VDC	Square	0.079 in	2 mm	Varies by Wire Gauge	1 µm	39.4 µin	Board to Cable/Wire	Tin-Bismuth	Header	UL94 V-0	Black	Tin-Bismuth	Nylon Polyamide (PA)	1	Surface Mount	Solder Retention	Male Pin	All	Solder	9.91 mm	0.39 in	Shrouded - 4 Wall	Latch Lock	-40 °C	105 ░C
Molex 2170630034	Brass		250 VAC	Square	0.079 in	2 mm	Varies by Wire Gauge	1 µm	39.4 µin	Board to Cable/Wire	Tin	Header	UL94 V-0	Natural		Nylon Polyamide (PA)	1	Surface Mount	Solder Retention	Male Pin	All	Solder	9.91 mm	0.39 in	Shrouded - 4 Wall	Friction Lock	-40 °C	105 ░C	1 çm	39.4 çin
Molex 2170630065	Brass	6	250 VDC	Square	0.079 in	2 mm	Varies by Wire Gauge	1 µm	39.4 µin	Board to Cable/Wire	Tin-Bismuth	Header	UL94 V-0	Black	Tin-Bismuth	Nylon Polyamide (PA)	1	Surface Mount	Solder Retention	Male Pin	All	Solder	9.91 mm	0.39 in	Shrouded - 4 Wall	Latch Lock	-40 °C	105 ░C	1 çm	39.4 çin
Molex 2170630085	Brass	8	250 VDC	Square	0.079 in	2 mm	Varies by Wire Gauge	1 µm	39.4 µin	Board to Cable/Wire	Tin-Bismuth	Header	UL94 V-0	Black	Tin-Bismuth	Nylon Polyamide (PA)	1	Surface Mount	Solder Retention	Male Pin	All	Solder	9.91 mm	0.39 in	Shrouded - 4 Wall	Latch Lock	-40 °C	105 ░C	1 çm	39.4 çin
Molex 2170630077	Brass	7	250 VDC	Square	0.079 in	2 mm	Varies by Wire Gauge	1 µm	39.4 µin	Board to Cable/Wire	Tin-Bismuth	Header	UL94 V-0	Black	Tin-Bismuth	Nylon Polyamide (PA)	1	Surface Mount	Solder Retention	Male Pin	All	Solder	9.91 mm	0.39 in	Shrouded - 4 Wall	Latch Lock	-40 °C	105 ░C	1 çm	39.4 çin
Molex 2170630057	Brass		250 VDC	Square	0.079 in	2 mm	Varies by Wire Gauge	1 µm	39.4 µin	Board to Cable/Wire	Tin-Bismuth	Header	UL94 V-0	Black	Tin-Bismuth	Nylon Polyamide (PA)	1	Surface Mount	Solder Retention	Male Pin	All	Solder	9.91 mm	0.39 in	Shrouded - 4 Wall	Latch Lock	-40 °C	105 ░C	1 çm	39.4 çin

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

217063 Series

Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 6 Circuits, Tin-Bismuth Plating, Natural, with Potting Capability, with Cover Tape

Documents

Technical documentation and resources

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