Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 6 Circuits, Tin-Bismuth Plating, Natural, with Potting Capability, with Cover Tape
Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 6 Circuits, Tin-Bismuth Plating, Natural, with Potting Capability, with Cover Tape
Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 6 Circuits, Tin-Bismuth Plating, Natural, with Potting Capability, with Cover Tape
| Part | Contact Material | Number of Positions | Voltage Rating | Contact Shape | Pitch - Mating [x] | Pitch - Mating [x] | Current Rating (Amps) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Style | Contact Finish - Post | Connector Type | Material Flammability Rating | Insulation Color | Contact Finish - Mating | Insulation Material | Number of Rows | Mounting Type | Features | Contact Type | Number of Positions Loaded | Termination | Insulation Height [z] | Insulation Height [z] | Shrouding | Fastening Type | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Molex | Brass | 4 | 250 VDC | Square | 0.079 in | 2 mm | Varies by Wire Gauge | 1 µm | 39.4 µin | Board to Cable/Wire | Tin-Bismuth | Header | UL94 V-0 | Black | Tin-Bismuth | Nylon Polyamide (PA) | 1 | Surface Mount | Solder Retention | Male Pin | All | Solder | 9.91 mm | 0.39 in | Shrouded - 4 Wall | Latch Lock | -40 °C | 105 ░C | ||
Molex | Brass | 250 VAC | Square | 0.079 in | 2 mm | Varies by Wire Gauge | 1 µm | 39.4 µin | Board to Cable/Wire | Tin | Header | UL94 V-0 | Natural | Nylon Polyamide (PA) | 1 | Surface Mount | Solder Retention | Male Pin | All | Solder | 9.91 mm | 0.39 in | Shrouded - 4 Wall | Friction Lock | -40 °C | 105 ░C | 1 çm | 39.4 çin | ||
 Molex | Brass | 6 | 250 VDC | Square | 0.079 in | 2 mm | Varies by Wire Gauge | 1 µm | 39.4 µin | Board to Cable/Wire | Tin-Bismuth | Header | UL94 V-0 | Black | Tin-Bismuth | Nylon Polyamide (PA) | 1 | Surface Mount | Solder Retention | Male Pin | All | Solder | 9.91 mm | 0.39 in | Shrouded - 4 Wall | Latch Lock | -40 °C | 105 ░C | 1 çm | 39.4 çin |
 Molex | Brass | 8 | 250 VDC | Square | 0.079 in | 2 mm | Varies by Wire Gauge | 1 µm | 39.4 µin | Board to Cable/Wire | Tin-Bismuth | Header | UL94 V-0 | Black | Tin-Bismuth | Nylon Polyamide (PA) | 1 | Surface Mount | Solder Retention | Male Pin | All | Solder | 9.91 mm | 0.39 in | Shrouded - 4 Wall | Latch Lock | -40 °C | 105 ░C | 1 çm | 39.4 çin |
Molex | Brass | 7 | 250 VDC | Square | 0.079 in | 2 mm | Varies by Wire Gauge | 1 µm | 39.4 µin | Board to Cable/Wire | Tin-Bismuth | Header | UL94 V-0 | Black | Tin-Bismuth | Nylon Polyamide (PA) | 1 | Surface Mount | Solder Retention | Male Pin | All | Solder | 9.91 mm | 0.39 in | Shrouded - 4 Wall | Latch Lock | -40 °C | 105 ░C | 1 çm | 39.4 çin |
Molex | Brass | 250 VDC | Square | 0.079 in | 2 mm | Varies by Wire Gauge | 1 µm | 39.4 µin | Board to Cable/Wire | Tin-Bismuth | Header | UL94 V-0 | Black | Tin-Bismuth | Nylon Polyamide (PA) | 1 | Surface Mount | Solder Retention | Male Pin | All | Solder | 9.91 mm | 0.39 in | Shrouded - 4 Wall | Latch Lock | -40 °C | 105 ░C | 1 çm | 39.4 çin |