Deep-Dive with AI
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Deep-Dive with AI
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Technical Specifications
Parameters and characteristics for this part
| Specification | 30-PRS16020-12 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 0.76 Ám |
| Contact Finish Thickness - Mating | 30 Áin |
| Contact Finish Thickness - Post | 200 µin |
| Contact Finish Thickness - Post | 5.08 µm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Current Rating (Amps) | 1 A |
| Features | Closed Frame |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -65 ░C |
| Pitch - Mating | 0.1 " |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 0.1 in |
| Pitch - Post | 2.54 mm |
| Termination | Solder |
| Termination Post Length | 0.125 in |
| Termination Post Length | 3.18 mm |
| Type | PGA, ZIF (ZIP) |
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Contact Material - Post | Contact Finish - Mating | Features | Mounting Type | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Type | Termination | Operating Temperature [Min] | Operating Temperature [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 1 A | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | Beryllium Copper | Beryllium Copper | Gold | Closed Frame | Through Hole | 0.1 in | 2.54 mm | 0.76 Ám | 30 Áin | Tin | PGA ZIF (ZIP) | Solder | -65 ░C | 125 °C |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 1 A | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | Beryllium Copper | Beryllium Copper | Gold | Closed Frame | Through Hole | 0.1 in | 2.54 mm | 0.76 Ám | 30 Áin | Tin | PGA ZIF (ZIP) | Solder | -65 ░C | 125 °C |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 1 A | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | Beryllium Copper | Beryllium Copper | Gold | Closed Frame | Through Hole | 0.1 in | 2.54 mm | 0.76 Ám | 30 Áin | Tin | PGA ZIF (ZIP) | Solder | -65 ░C | 125 °C |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 1 A | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | Beryllium Copper | Beryllium Copper | Gold | Closed Frame | Through Hole | 0.1 in | 2.54 mm | 0.76 Ám | 30 Áin | Tin | PGA ZIF (ZIP) | Solder | -65 ░C | 125 °C |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 6 | $ 80.41 | |
| N/A | 0 | $ 86.40 | ||
Description
General part information
30-PRS1 Series
Pos PGA, ZIF (ZIP) Socket Gold Through Hole
Documents
Technical documentation and resources