30-PRS1 Series
Manufacturer: Aries Electronics
CONN SOCKET PGA ZIF GOLD
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Contact Material - Post | Contact Finish - Mating | Features | Mounting Type | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Type | Termination | Operating Temperature [Min] | Operating Temperature [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 1 A | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | Beryllium Copper | Beryllium Copper | Gold | Closed Frame | Through Hole | 0.1 in | 2.54 mm | 0.76 Ám | 30 Áin | Tin | PGA ZIF (ZIP) | Solder | -65 ░C | 125 °C |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 1 A | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | Beryllium Copper | Beryllium Copper | Gold | Closed Frame | Through Hole | 0.1 in | 2.54 mm | 0.76 Ám | 30 Áin | Tin | PGA ZIF (ZIP) | Solder | -65 ░C | 125 °C |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 1 A | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | Beryllium Copper | Beryllium Copper | Gold | Closed Frame | Through Hole | 0.1 in | 2.54 mm | 0.76 Ám | 30 Áin | Tin | PGA ZIF (ZIP) | Solder | -65 ░C | 125 °C |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 1 A | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | Beryllium Copper | Beryllium Copper | Gold | Closed Frame | Through Hole | 0.1 in | 2.54 mm | 0.76 Ám | 30 Áin | Tin | PGA ZIF (ZIP) | Solder | -65 ░C | 125 °C |