Zenode.ai Logo
Beta
TO-78-6
Discrete Semiconductor Products

2N5794

Active
Microchip Technology

DUAL SMALL-SIGNAL BJT TO-78 ROHS COMPLIANT: YES

Deep-Dive with AI

Search across all available documentation for this part.

TO-78-6
Discrete Semiconductor Products

2N5794

Active
Microchip Technology

DUAL SMALL-SIGNAL BJT TO-78 ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

Specification2N5794
Current - Collector (Ic) (Max) [Max]600 mA
Current - Collector Cutoff (Max) [Max]10 µA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]100
Mounting TypeThrough Hole
Package / CaseTO-78-6 Metal Can
Power - Max [Max]600 mW
Supplier Device PackageTO-78-6
Transistor Type2 NPN (Dual)
Vce Saturation (Max) @ Ib, Ic900 mV
Voltage - Collector Emitter Breakdown (Max)40 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 100$ 36.64
Microchip DirectN/A 1$ 39.47
NewarkEach 100$ 36.64
500$ 35.24

Description

General part information

2N5795-Dual-Transistor Series

This specification covers the performance requirements for two electrically isolated, PNP silicon, 2N5795 and 2N5796 unitized, dual 2N2907A transistors as one dual unit for high speed saturated switching applications. Both matched and unmatched types are covered. Four levels of product assurance (JAN, JANTX, JANTXV and JANS) are provided for each device type as specified in MIL-PRF-19500/496. Provisions for radiation hardness assurance (RHA) are provided for JANTXV and JANS product assurance levels. RHA level designators "M", "D", "P", "L", "R", "F", "G" and "H" are appended to the device prefix to identify devices, which have passed RHA requirements. The device package outlines are as follows: through hole mount TO-78 package and surface mount LCC6 (U) and ceramic lid surface mount LCC package.

Documents

Technical documentation and resources