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Technical Specifications
Parameters and characteristics for this part
| Specification | 105976-HMC329LM3 |
|---|---|
| Contents | Board(s) |
| Frequency [Max] | 40 GHz |
| Frequency [Min] | 26 GHz |
| Type | Mixer |
| Utilized IC / Part | HMC329LM3 |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
Description
General part information
HMC329ALC3B Series
The HMC329 devices are double-balanced MMIC mixers that are available in a chip (HMC329), a leadless RoHS compliant SMT package (HMC329LC3B), and an SMT leadless chip carrier package (HMC329LM3). The HMC329 devices can be used as an upconverter or downconverter. On the HMC329, the mixer is used as an upconverter or downcnverter in a small chip area of 0.85 mm × 0.55 mm. Excellent isolations are provided by on-chip baluns, and the chip requires no external components and no dc bias. Measurements for the HMC329 were made with the chip mounted and ribbon bonded into in a 50 Ω microstrip test fixture that contains 5 mil alumina substrates between the chip and K connectors. Measured data includes the parasitic effects of the assembly. RF connections to the chip were made with 0.076 mm (3 mil) ribbon bond with minimal length less than 0.31 mm (<12 mil).ApplicationsMicrowave point-to-point radiosPoint-to-point radiosPoint-to-multipoint radios and very small aperture terminal (VSAT)Local multipoint distribution systems (LMDS)Satellite communications (SATCOM)Test equipment and sensorsMilitary end useRADAR
Documents
Technical documentation and resources