Catalog
22 GHz to 38 GHz, GaAs, MMIC, Double Balanced Mixer
Key Features
• DownconverterConversion loss9 dB typical for 22 GHz to 29 GHz11 dB typical for 29 GHz to 38 GHzLO to RF isolation37 dB typical for 22 GHz to 29 GHz36 dB typical for 29 GHz to 38 GHzLO to IF isolation30 dB typical for 22 GHz to 29 GHz27 dB typical for 29 GHz to 38 GHzRF to IF isolation31 dB typical for 22 GHz to 29 GHz34 dB typical for 29 GHz to 38 GHzInput IP317 dBm typical for 22 GHz to 29 GHz21 dBm typical for 29 GHz to 38 GHz
• Conversion loss9 dB typical for 22 GHz to 29 GHz11 dB typical for 29 GHz to 38 GHz
• 9 dB typical for 22 GHz to 29 GHz
• 11 dB typical for 29 GHz to 38 GHz
• LO to RF isolation37 dB typical for 22 GHz to 29 GHz36 dB typical for 29 GHz to 38 GHz
• 37 dB typical for 22 GHz to 29 GHz
• 36 dB typical for 29 GHz to 38 GHz
• LO to IF isolation30 dB typical for 22 GHz to 29 GHz27 dB typical for 29 GHz to 38 GHz
• 30 dB typical for 22 GHz to 29 GHz
• 27 dB typical for 29 GHz to 38 GHz
• RF to IF isolation31 dB typical for 22 GHz to 29 GHz34 dB typical for 29 GHz to 38 GHz
• 31 dB typical for 22 GHz to 29 GHz
• 34 dB typical for 29 GHz to 38 GHz
• Input IP317 dBm typical for 22 GHz to 29 GHz21 dBm typical for 29 GHz to 38 GHz
• 17 dBm typical for 22 GHz to 29 GHz
• 21 dBm typical for 29 GHz to 38 GHz
• IF rangeDC to 8 GHz
• DC to 8 GHz
• Passive, no dc bias required
• Small size0.87 × 0.58 × 0.102 mm
• 0.87 × 0.58 × 0.102 mm
Description
AI
The HMC329 devices are double-balanced MMIC mixers that are available in a chip (HMC329), a leadless RoHS compliant SMT package (HMC329LC3B), and an SMT leadless chip carrier package (HMC329LM3). The HMC329 devices can be used as an upconverter or downconverter. On the HMC329, the mixer is used as an upconverter or downcnverter in a small chip area of 0.85 mm × 0.55 mm. Excellent isolations are provided by on-chip baluns, and the chip requires no external components and no dc bias. Measurements for the HMC329 were made with the chip mounted and ribbon bonded into in a 50 Ω microstrip test fixture that contains 5 mil alumina substrates between the chip and K connectors. Measured data includes the parasitic effects of the assembly. RF connections to the chip were made with 0.076 mm (3 mil) ribbon bond with minimal length less than 0.31 mm (<12 mil).ApplicationsMicrowave point-to-point radiosPoint-to-point radiosPoint-to-multipoint radios and very small aperture terminal (VSAT)Local multipoint distribution systems (LMDS)Satellite communications (SATCOM)Test equipment and sensorsMilitary end useRADAR
