Connectors, Interconnects

81-PGM09001-10

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IC & COMPONENT SOCKETS PIN GRID ARRAY SOLDER TAIL 81 PINS

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Connectors, Interconnects

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IC & COMPONENT SOCKETS PIN GRID ARRAY SOLDER TAIL 81 PINS

Technical Specifications

Parameters and characteristics for this part

Specification	81-PGM09001-10

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	0.25 µm
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length	4.19 mm
Termination Post Length	0.165 "
Type	PGA

Part	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Mounting Type	Contact Finish - Mating	Contact Finish - Post	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Housing Material	Pitch - Post	Pitch - Post	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)
Aries Electronics 160-PGM14029-40	PGA	0.25 µm	10 µin	0.1 "	2.54 mm	Brass	Through Hole	Gold	Tin	-55 C	105 ░C	Solder	200 µin	5.08 µm	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm
Aries Electronics 81-PGM09001-10	PGA	0.25 µm	10 µin	0.1 "	2.54 mm	Brass	Through Hole	Gold	Tin	-55 C	105 ░C	Solder	200 µin	5.08 µm	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	UL94 V-0	4.19 mm	0.165 "	3 A
Aries Electronics 68-PGM11032-11	PGA	0.25 µm	10 µin	0.1 "	2.54 mm	Brass	Through Hole	Gold	Gold	-55 C	125 °C	Solder	10 Áin	0.25 çm	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm
Aries Electronics 100-PGM13069-11	PGA	0.25 µm	10 µin	0.1 "	2.54 mm	Brass	Through Hole	Gold	Gold	-55 C	125 °C	Solder	10 Áin	0.25 çm	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Pos PGA Socket Gold Through Hole

Technical documentation and resources