Connectors, Interconnects

160-PGM14029-40

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IC & COMPONENT SOCKETS PIN GRID ARRAY SOLDER TAIL 160 PINS

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Connectors, Interconnects

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IC & COMPONENT SOCKETS PIN GRID ARRAY SOLDER TAIL 160 PINS

Technical Specifications

Parameters and characteristics for this part

Specification	160-PGM14029-40

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	0.25 µm
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Mounting Type	Through Hole
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Type	PGA

Part	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Mounting Type	Contact Finish - Mating	Contact Finish - Post	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Housing Material	Pitch - Post	Pitch - Post	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)
Aries Electronics 160-PGM14029-40	PGA	0.25 µm	10 µin	0.1 "	2.54 mm	Brass	Through Hole	Gold	Tin	-55 C	105 ░C	Solder	200 µin	5.08 µm	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm
Aries Electronics 81-PGM09001-10	PGA	0.25 µm	10 µin	0.1 "	2.54 mm	Brass	Through Hole	Gold	Tin	-55 C	105 ░C	Solder	200 µin	5.08 µm	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	UL94 V-0	4.19 mm	0.165 "	3 A
Aries Electronics 68-PGM11032-11	PGA	0.25 µm	10 µin	0.1 "	2.54 mm	Brass	Through Hole	Gold	Gold	-55 C	125 °C	Solder	10 Áin	0.25 çm	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm
Aries Electronics 100-PGM13069-11	PGA	0.25 µm	10 µin	0.1 "	2.54 mm	Brass	Through Hole	Gold	Gold	-55 C	125 °C	Solder	10 Áin	0.25 çm	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm

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General part information

IC & COMPONENT SOCKETS PIN GRID ARRAY SOLDER TAIL 160 PINS

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