Integrated Circuits (ICs)

TSPC603RVGU10LC

Obsolete

Microchip Technology

IC MPU 233MHZ 255CBGA

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DocumentsTSPC603RVGU10LC | Datasheet

Integrated Circuits (ICs)

TSPC603RVGU10LC

Obsolete

Microchip Technology

IC MPU 233MHZ 255CBGA

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DocumentsTSPC603RVGU10LC | Datasheet

Specifications Series Pricing CAD Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	TSPC603RVGU10LC

Bus Width	32 Bit
Core Processor	PowerPC 603e
Graphics Acceleration	No
Mounting Type	Surface Mount
Number of Cores	1 Core
Operating Temperature (Max)	110 °C
Operating Temperature (Min)	-40 °C
Package / Case	255-BCBGA Exposed Pad
Package Length	21 mm
Package Name	255-CBGA
Package Width	21 mm
Speed	233 MHz
Voltage - I/O	3.3 V

TSPC603 Series

Part	Package Name	Package Length	Package Width	Operating Temperature (Min)	Operating Temperature (Max)	Bus Width	Number of Cores	Core Processor	Graphics Acceleration	Voltage - I/O	Mounting Type	Package / Case	Speed
Microchip Technology TSPC603RVGU8LC	255-CBGA	21 mm	21 mm	-40 °C	110 °C	32 Bit	1 Core	PowerPC 603e	No	3.3 V	Surface Mount	255-BCBGA Exposed Pad	200 MHz
Microchip Technology TSPC603RVGH10LC	255-HiTCE-CBGA	21 mm	21 mm	-40 °C	110 °C	32 Bit	1 Core	PowerPC 603e	No	3.3 V	Surface Mount	255-BCBGA Exposed Pad	233 MHz
Microchip Technology TSPC603RVGU10LC	255-CBGA	21 mm	21 mm	-40 °C	110 °C	32 Bit	1 Core	PowerPC 603e	No	3.3 V	Surface Mount	255-BCBGA Exposed Pad	233 MHz
Microchip Technology TSPC603RVA8LC	240-CERQUAD	31 mm	31 mm	-40 °C	110 °C	32 Bit	1 Core	PowerPC 603e	No	3.3 V	Surface Mount	240-BFCQFP	200 MHz
Microchip Technology TSPC603RVGH12LC	255-HiTCE-CBGA	21 mm	21 mm	-40 °C	110 °C	32 Bit	1 Core	PowerPC 603e	No	3.3 V	Surface Mount	255-BCBGA Exposed Pad	266 MHz
Microchip Technology TSPC603RVGH8LC	255-HiTCE-CBGA	21 mm	21 mm	-40 °C	110 °C	32 Bit	1 Core	PowerPC 603e	No	3.3 V	Surface Mount	255-BCBGA Exposed Pad	200 MHz
Microchip Technology TSPC603RVGS6LC	255-CI-CBGA	21 mm	21 mm	-40 °C	110 °C	32 Bit	1 Core	PowerPC 603e	No	3.3 V	Surface Mount	255-BCBGA Exposed Pad	166 MHz
Microchip Technology TSPC603RVGU12LC	255-CBGA	21 mm	21 mm	-40 °C	110 °C	32 Bit	1 Core	PowerPC 603e	No	3.3 V	Surface Mount	255-BCBGA Exposed Pad	266 MHz
Microchip Technology TSPC603RVGS10LC	255-CI-CBGA	21 mm	21 mm	-40 °C	110 °C	32 Bit	1 Core	PowerPC 603e	No	3.3 V	Surface Mount	255-BCBGA Exposed Pad	233 MHz
Microchip Technology TSPC603RVGS8LC	255-CI-CBGA	21 mm	21 mm	-40 °C	110 °C	32 Bit	1 Core	PowerPC 603e	No	3.3 V	Surface Mount	255-BCBGA Exposed Pad	200 MHz

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$	Updated

Digikey	Tray	60	$ 162.55	<2d

CAD

3D models and CAD resources for this part

Description

General part information

TSPC603 Series

PowerPC 603e Microprocessor IC - 1 Core, 32-Bit 233MHz 255-CBGA (21x21)

Documents

Technical documentation and resources

TSPC603RVGU10LC | Datasheet

Datasheet