TSPC603 Series

Catalog

IC MPU 200MHZ 255CBGA

Part	Package Name	Package Length	Package Width	Operating Temperature (Min)	Operating Temperature (Max)	Bus Width	Number of Cores	Core Processor	Graphics Acceleration	Voltage - I/O	Mounting Type	Package / Case	Speed
Microchip Technology TSPC603RVGU8LC	255-CBGA	21 mm	21 mm	-40 °C	110 °C	32 Bit	1 Core	PowerPC 603e	No	3.3 V	Surface Mount	255-BCBGA Exposed Pad	200 MHz
Microchip Technology TSPC603RVGH10LC	255-HiTCE-CBGA	21 mm	21 mm	-40 °C	110 °C	32 Bit	1 Core	PowerPC 603e	No	3.3 V	Surface Mount	255-BCBGA Exposed Pad	233 MHz
Microchip Technology TSPC603RVGU10LC	255-CBGA	21 mm	21 mm	-40 °C	110 °C	32 Bit	1 Core	PowerPC 603e	No	3.3 V	Surface Mount	255-BCBGA Exposed Pad	233 MHz
Microchip Technology TSPC603RVA8LC	240-CERQUAD	31 mm	31 mm	-40 °C	110 °C	32 Bit	1 Core	PowerPC 603e	No	3.3 V	Surface Mount	240-BFCQFP	200 MHz
Microchip Technology TSPC603RVGH12LC	255-HiTCE-CBGA	21 mm	21 mm	-40 °C	110 °C	32 Bit	1 Core	PowerPC 603e	No	3.3 V	Surface Mount	255-BCBGA Exposed Pad	266 MHz
Microchip Technology TSPC603RVGH8LC	255-HiTCE-CBGA	21 mm	21 mm	-40 °C	110 °C	32 Bit	1 Core	PowerPC 603e	No	3.3 V	Surface Mount	255-BCBGA Exposed Pad	200 MHz
Microchip Technology TSPC603RVGS6LC	255-CI-CBGA	21 mm	21 mm	-40 °C	110 °C	32 Bit	1 Core	PowerPC 603e	No	3.3 V	Surface Mount	255-BCBGA Exposed Pad	166 MHz
Microchip Technology TSPC603RVGU12LC	255-CBGA	21 mm	21 mm	-40 °C	110 °C	32 Bit	1 Core	PowerPC 603e	No	3.3 V	Surface Mount	255-BCBGA Exposed Pad	266 MHz
Microchip Technology TSPC603RVGS10LC	255-CI-CBGA	21 mm	21 mm	-40 °C	110 °C	32 Bit	1 Core	PowerPC 603e	No	3.3 V	Surface Mount	255-BCBGA Exposed Pad	233 MHz
Microchip Technology TSPC603RVGS8LC	255-CI-CBGA	21 mm	21 mm	-40 °C	110 °C	32 Bit	1 Core	PowerPC 603e	No	3.3 V	Surface Mount	255-BCBGA Exposed Pad	200 MHz